0001193125-14-348710 Sample Contracts

AGREEMENT AND PLAN OF MERGER by and among VIASYSTEMS GROUP, INC., TTM TECHNOLOGIES, INC. and VECTOR ACQUISITION CORP. Dated as of September 21, 2014

Agreement and Plan of Merger • September 22nd, 2014 • Viasystems Group Inc • Printed circuit boards • Delaware

• Contract Type
  Agreement and Plan of Merger
• Filed
  September 22nd, 2014
• Company
  Viasystems Group Inc
• Industry
  Printed circuit boards
• Jurisdiction
  Delaware

THIS AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of September 21, 2014, by and among Viasystems Group, Inc., a Delaware corporation (the “Company”), TTM Technologies, Inc., a Delaware corporation (“Parent”), and Vector Acquisition Corp., a Delaware corporation and wholly owned Subsidiary of Parent (“Merger Sub” and, collectively with the Company and Parent, the “Parties”).