PLATING PROCESSING AGREEMENTPlating Processing Agreement • May 10th, 2013 • Diodes Inc /Del/ • Semiconductors & related devices
This PLATING PROCESSING AGREEMENT (this “Agreement”) is made as of February 8, 2013 (the “Effective Date”), by and between Zetex (Chengdu) Electronic Company Limited (Party A- the licensed subcontractor), with its registered address at No. 66 East Rainbow Road, Chenghua District, Chengdu, Sichuan Province, China and Diodes Technology (Chengdu) Company Limited (Party B- the customer), with its registered address at No. 1 Standard Workshop, No. 8 Kexin Road, Chengdu Hi-Tech Zone (West Park), Chengdu, Sichuan Province, China 611731. Party A and Party B are collectively refer to as “Parties” or individually refer to as “Party” hereinafter.
