NXP B.V. NXP FUNDING LLC as Issuers EACH OF THE GUARANTORS PARTY HERETO and DEUTSCHE BANK TRUST COMPANY AMERICAS, as Trustee $500,000,000 5.75% Senior Notes due 2021 SENIOR INDENTURE Dated as of February 14, 2013Senior Indenture • March 1st, 2013 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
INDENTURE dated as of February 14, 2013, among NXP B.V. (the “Company”), NXP Funding LLC (the “Co-Issuer” and, together with the Company, the “Issuers”), the Guarantors (as defined herein) and Deutsche Bank Trust Company Americas, as trustee (the “Trustee”).
NEW TERM LOAN JOINDER AGREEMENTNew Term Loan Joinder Agreement • March 1st, 2013 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
This New Term Loan Joinder Agreement (this “Agreement”) dated as of December 10, 2012 to the Credit Agreement referenced below is by and among the Tranche C Lenders, the Borrowers and the Administrative Agent (each as defined below) under the Credit Agreement referenced below.
INCREMENTAL JOINDER AGREEMENTIncremental Joinder Agreement • March 1st, 2013 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
This Incremental Joinder Agreement (this “Agreement”) dated as of October 24, 2012 to the Credit Agreement referenced below is by and among the 2012 Incremental Lenders, the Borrowers and the Administrative Agent (each as defined below) under the Credit Agreement referenced below.
SECURED REVOLVING CREDIT AGREEMENT Dated as of April 27, 2012 among NXP SEMICONDUCTORS N.V., NXP B.V., NXP FUNDING LLC, as the Borrowers The Several LENDERS from Time to Time Parties Hereto MORGAN STANLEY SENIOR FUNDING, INC., as Global Collateral...Secured Revolving Credit Agreement • March 1st, 2013 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
CREDIT AGREEMENT dated as of April 27, 2012 (as amended, modified, supplemented or restated from time to time, this “Agreement”) among NXP SEMICONDUCTORS N.V., with its corporate seat in Eindhoven, the Netherlands (“Holdings”), NXP B.V. with its corporate seat in Eindhoven, the Netherlands (the “Company”), NXP FUNDING LLC (the “Co-Borrower”), the lending institutions from time to time parties hereto (each a “Lender” and, collectively, the “Lenders”), MORGAN STANLEY SENIOR FUNDING, INC., as Administrative Agent (in such capacity, the “Administrative Agent”), MORGAN STANLEY SENIOR FUNDING, INC., as Global Collateral Agent (in such capacity, the “Global Collateral Agent”), MIZUHO CORPORATE BANK, LTD., as Taiwan Collateral Agent (in such capacity, the “Taiwan Collateral Agent”) and MORGAN STANLEY SENIOR FUNDING, INC. and BARCLAYS BANK PLC as Joint Lead Arrangers (each, in such capacity, a “Joint Lead Arranger”) and Joint Bookrunners (each, in such capacity, a “Joint Bookrunner”).
