Amendment to Kun-Mortgage Agreement (Increase of Maximum Credit Amount)Amkor Technology Inc • November 27th, 2012 • Semiconductors & related devices
Whereas the above mentioned parties entered into the Kun-Mortgage Agreement (the “Agreement”) dated July 2, 2012 on the properties described in the attachment and completed the following registrations of kun-mortgage submitted to the Registration Division of the Seoul Eastern District Court under the submission No. 39384 on July 4, 2012:
LOAN AGREEMENT USD 100,000,000 AMKOR TECHNOLOGY KOREA, INC. - Borrower - THE KOREA DEVELOPMENT BANK - Lender - November 23, 2012Loan Agreement • November 27th, 2012 • Amkor Technology Inc • Semiconductors & related devices
AMKOR TECHNOLOGY KOREA, INC., a corporation (chusik hoesa) organized and existing under the laws of Republic of Korea (“Korea”), with its registered head office at 100, Amkor-ro, Buk-gu, Gwangju, Korea (the “Borrower”); and
