Summary English Translation of Maximum Mortgage Agreement dated September 27, 2011 by and between BCD (Shanghai) Micro-Electronics Ltd. and Nanjing Bank Shanghai Branch Parties: Bank of Nanjing Shanghai Branch (the “Bank”) and BCD (Shanghai)...BCD Semiconductor Manufacturing LTD • April 25th, 2012 • Semiconductors & related devices
In order to secure the fulfillment by Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. (“SIM-BCD”) of its obligations under the Maximum Credit Line Agreement (“Principal Agreement”), BCD Shanghai ME agrees to pledge certain real property held by it as guaranty.
ContractBCD Semiconductor Manufacturing LTD • April 25th, 2012 • Semiconductors & related devices
Summary English Translation of Amendment dated December 13, 2011, to Investment Agreement dated August 2, 2010, by and among Shanghai Zizhu Science-based Park Development Co., Ltd., BCD (Shanghai) Semiconductor Manufacturing Limited and BCD (Shanghai) Micro-Electronics Ltd.
ContractBCD Semiconductor Manufacturing LTD • April 25th, 2012 • Semiconductors & related devices
Summary English Translation of Maximum Guarantee Agreement dated November 30, 2011 by and between BCD (Shanghai) Micro-Electronics Ltd. and Agricultural Bank of China Shanghai Xuhui Subbranch
Summary English Translation of Maximum Credit Line Agreement dated September 26, 2011 and entered into on September 27, 2011 by and between Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. and Bank of Nanjing Shanghai Branch Parties: Bank of...BCD Semiconductor Manufacturing LTD • April 25th, 2012 • Semiconductors & related devices • Shanghai
• Any credit facility which is fully secured, fully and irrevocably guaranteed by a financial institution accepted by the Bank, fully insured or fully guaranteed by any other risk-eliminating methods shall not be counted towards the maximum credit line.
Summary English Translation of Investment and Cooperation Agreement dated August 22, 2011 by and between Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. and Shanghai SIMAT Microelectronics Technology Co., Ltd. Party A: Shanghai SIM-BCD...BCD Semiconductor Manufacturing LTD • April 25th, 2012 • Semiconductors & related devices
This Agreement (“Agreement”) is entered into on August 22, 2011 by and between Party A and Party B with respect to Party A’s investment in Party B and the cooperation on the TDIP-8 project between both parties in accordance with the relevant provisions in the TDIP-8 Cooperation Agreement between the parties dated on July 8, 2011.
ContractBCD Semiconductor Manufacturing LTD • April 25th, 2012 • Semiconductors & related devices
Summary English Translation of Maximum Guarantee Agreement dated April 20, 2011 by and between BCD (Shanghai) Micro-Electronics Ltd. and China CITIC Bank Shanghai Branch
