Banking Facility Letter Agreement No.: (2011) Nanzi 0011816001Banking Facility Letter • March 16th, 2012 • Nam Tai Electronics Inc • Electronic components, nec
As applied for by Party B, Party A agrees to grant banking facilities to Party B. This agreement is hereby made by and between Party A and Party B as follows upon consultation in accordance with relevant laws.
Irrevocable Guarantee for Maximum Amount Contract No.: 2011 Nanzi. No.0011818815-1Nam Tai Electronics Inc • March 16th, 2012 • Electronic components, nec
The Bank and Wuxi Zastron Precision-Flex Co., Ltd, (the “Borrower”) have entered into the Banking Facility Letter No. (2011) Nanzi 0011818815 (the “Facility Agreement”) on January 12, 2012. According to the Facility Agreement, between January 18, 2012 and January 18, 2013 (the “Term of Facilities”), the Bank shall provide banking facilities up to RMB 50 million (including other currencies of the equivalent value) to the Borrower.
Irrevocable Guarantee for Maximum Amount Contract No.: 2011 Nanzi. No. 0011816001Maximum Amount • March 16th, 2012 • Nam Tai Electronics Inc • Electronic components, nec
The Bank and Zastron Electronic (Shenzhen) Co., Ltd., (the “Borrower”) entered into the Banking Facility Letter No. (2011) Nanzi 0011816001 (the “Facility Agreement”) on January 13, 2012. According to the Facility Agreement, between January 18, 2012 and January 18, 2013 (the “Term of Facilities”), the Bank shall provide banking facilities up to RMB300 million (including other currencies of the equivalent value) to the Borrower.
