SECURED TERM CREDIT AGREEMENT Dated as of 4 March 2011 among NXP B.V., NXP FUNDING LLC, as the Borrowers The Several Lenders from Time to Time Parties Hereto MORGAN STANLEY SENIOR FUNDING, INC., as Global Collateral Agent MIZUHO CORPORATE BANK, LTD.,...Credit Agreement • March 13th, 2012 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
CREDIT AGREEMENT dated as of March 4, 2011, among NXP B.V. with its corporate seat in Eindhoven, the Netherlands (the “Company”), NXP FUNDING LLC (the “Co-Borrower”), the lending institutions from time to time parties hereto (each a “Lender” and, collectively, the “Lenders”), Barclays Bank PLC, as Administrative Agent (in such capacity, the “Administrative Agent”), MORGAN STANLEY SENIOR FUNDING, INC., as Global Collateral Agent (in such capacity, the “Global Collateral Agent”), MIZUHO CORPORATE BANK, LTD., as Taiwan Collateral Agent (in such capacity, the “Taiwan Collateral Agent”) and BARCLAYS CAPITAL (the investment banking division of Barclays Bank PLC) as Sole Lead Arranger (the “Sole Lead Arranger”) and Sole Bookrunner (the “Sole Bookrunner”).
Agreement on Lease of Standard Plant Basement of Export Processing Zone Administration, Ministry of Economic AffairsNXP Semiconductors N.V. • March 13th, 2012 • Semiconductors & related devices
Whereas both parties agree that Party A leases to Party B the basement located at 106 Inner Ring (south) Road, Nanzi Processing Zone, both parties hereby reach the following agreement as follows:
NXP B.V. NXP FUNDING LLC as Issuers EACH OF THE GUARANTORS PARTY HERETO DEUTSCHE BANK TRUST COMPANY AMERICAS, as Trustee and as Paying Agent, Registrar, Transfer Agent and Calculation Agent MORGAN STANLEY SENIOR FUNDING, INC., as Global Collateral...Assignment Agreement • March 13th, 2012 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
INDENTURE dated as of November 10, 2011, among NXP B.V. (the “Company”), NXP Funding LLC (the “Co-Issuer” and, together with the Company, the “Issuers”), the Guarantors (as defined herein), Deutsche Bank Trust Company Americas, as trustee (the “Trustee”) and as Paying Agent, Registrar, Transfer Agent and Calculation Agent (each as defined herein), Morgan Stanley Senior Funding, Inc., as global collateral agent (the “Global Collateral Agent”), and Mizuho Corporate Bank, Ltd., as Taiwan collateral agent (the “Taiwan Collateral Agent”).
NEW TERM LOAN JOINDER AGREEMENTNew Term Loan Joinder Agreement • March 13th, 2012 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
This New Term Loan Joinder Agreement (this “Agreement”) dated as of February 16, 2012 to the Credit Agreement referenced below is by and among the Tranche B Lenders, the Borrowers and the Administrative Agent (each as defined below) under the Credit Agreement referenced below.
JOINDER AND AMENDMENT AGREEMENTJoinder and Amendment Agreement • March 13th, 2012 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
AGREEMENT (this “Agreement”) dated as of November 18, 2011 relating to the Credit Agreement dated as of March 4, 2011 (the “Credit Agreement”) among NXP B.V., with its corporate seat in Eindhoven, the Netherlands (the “Company”), NXP FUNDING LLC (the “Co-Borrower”), the lending institutions from time to time parties thereto, Barclays Bank PLC, as Administrative Agent (in such capacity, the “Administrative Agent”), Morgan Stanley Senior Funding, Inc., as Global Collateral Agent, and Mizuho Corporate Bank, Ltd., as Taiwan Collateral Agent.
