INDEMNITY AGREEMENTIndemnity Agreement • August 4th, 2010 • Spansion Inc. • Semiconductors & related devices • Delaware
This Indemnity Agreement (“Agreement”) is made as of by and between Spansion Inc., a Delaware corporation (the “Company”), and (“Indemnitee”). This Agreement supersedes and replaces any and all previous agreements between the Company and Indemnitee covering the subject matter of this Agreement.
SPANSION INC., as Parent and SPANSION LLC, and certain of its subsidiaries party hereto, as Borrowers LOAN AND SECURITY AGREEMENT Dated as of May 10, 2010 CERTAIN FINANCIAL INSTITUTIONS, as Lenders and BANK OF AMERICA, N.A., as Administrative Agent,...Loan and Security Agreement • August 4th, 2010 • Spansion Inc. • Semiconductors & related devices • California
THIS LOAN AND SECURITY AGREEMENT (this “Agreement”) is dated as of May 10, 2010, among SPANSION INC., a Delaware corporation (“Parent”), SPANSION LLC, a Delaware limited liability company (“Spansion”) and certain of Spansion’s subsidiaries party hereto (such subsidiaries together with Spansion, individually, a “Borrower” and, collectively, the “Borrowers”), the financial institutions party to this Agreement from time to time as lenders (collectively, the “Lenders”), and BANK OF AMERICA, N.A., a national banking association, as Administrative Agent, as Sole Lead Arranger, as Sole Bookrunner, and as agent for the Lenders (in such capacity, “Agent”).
