LOAN MODIFICATION AGREEMENTLoan Modification Agreement • August 6th, 2007 • Hoku Scientific Inc • Miscellaneous electrical machinery, equipment & supplies
THIS LOAN MODIFICATION AGREEMENT (this "Agreement") is dated August 6, 2007 (the "Effective Date"), by and between HOKU MATERIALS, INC., a Delaware corporation (the "Borrower"), and BANK OF HAWAII, a Hawaii corporation (the "Bank").
SUPPLY AGREEMENTSupply Agreement • August 6th, 2007 • Hoku Scientific Inc • Miscellaneous electrical machinery, equipment & supplies
This Agreement is made as of June 18, 2007 (the “Effective Date”) between Global Expertise Wafer Division Ltd., a private company limited by shares incorporated in the British Virgin Islands with it registered number of 651896 and regional office in Malaysia at Suite 22.01, Level 22 Menara Citibank, 165 Jalan Ampang, 50450 Kuala Lumpur, Malaysia (hereinafter ‘GEWD”) and HOKU MATERIALS, INC. a Delaware corporation with its principal place of business located at 1075 Opakapaka Street, Kapolei, Hawaii USA 96707 (hereinafter “HOKU”).
AGREEMENT FOR ENGINEERING OF HOKU ELECTRIC SUBSTATION AND ASSOCIATED FACILITIESHoku Scientific Inc • August 6th, 2007 • Miscellaneous electrical machinery, equipment & supplies • Idaho
All notices, requests, demands and other communications which are required or may be given under this Agreement shall be in writing and shall be given to the intended recipient at the address specified below:
SUPPLY AGREEMENT (SUNTECH CONTRACT NO. PUR1-0706092)Supply Agreement • August 6th, 2007 • Hoku Scientific Inc • Miscellaneous electrical machinery, equipment & supplies • New York
This Agreement is made as of June 13, 2007 (the “Effective Date”) between WUXI SUNTECH POWER CO., LTD., a People’s Republic of China company (hereinafter “SUNTECH”) and HOKU MATERIALS, INC., a Delaware corporation (hereinafter “HOKU”). SUNTECH and HOKU are each referred to in this Agreement as a “Party” and collectively as the “Parties.”
