SENIOR FACILITY AGREEMENT dated 30 March 2007 for SPANSION JAPAN LIMITED arranged by GE CAPITAL LEASING CORPORATION as Mandated Lead Arranger and SUMISHO LEASE CO., LTD. and MITSUI LEASING & DEVELOPMENT, LTD. as Sub-Arrangers WITH GE CAPITAL LEASING...Facility Agreement • May 9th, 2007 • Spansion Inc. • Semiconductors & related devices
MEMORANDUM OF UNDERSTANDINGMemorandum of Understanding • May 9th, 2007 • Spansion Inc. • Semiconductors & related devices
THIS MEMORANDUM OF UNDERSTANDING (“MOU”) is entered into this 31st day of March, 2007 (the “Effective Date”) by and between Spansion Inc. (“Spansion”) and Fujitsu Limited (“Fujitsu”).
FIRST AMENDMENT TO CREDIT AGREEMENTCredit Agreement • May 9th, 2007 • Spansion Inc. • Semiconductors & related devices • New York
This FIRST AMENDMENT TO CREDIT AGREEMENT, dated as of March 22, 2007 (this “Agreement”), among SPANSION LLC, a Delaware limited liability company (the “Borrower”), SPANSION INC., a Delaware corporation (“Holdings”), the Lenders (such capitalized term and all other capitalized terms not otherwise defined herein to have the meanings provided in the recitals and in Article I below) who are signatories to this Agreement, the Additional Lenders that are signatories to this Agreement, and BANK OF AMERICA, N.A., as administrative agent (in such capacity, the “Administrative Agent”) for the Lenders.
SECURITY AGREEMENTSecurity Agreement • May 9th, 2007 • Spansion Inc. • Semiconductors & related devices • California
This SECURITY AGREEMENT (this “Agreement”) is dated as of March 30, 2007 and entered into by and among Spansion Japan Limited, a Japanese corporation (“Company”), GE Capital Leasing Corporation, as security agent for and representative of (in such capacity herein called “Security Agent”) Finance Parties (as hereinafter defined), and the financial institutions listed in Schedule 1 hereto (“Finance Parties”).
