0001193125-05-130919 Sample Contracts

RELEASE OF CLAIMS AGREEMENT

Release of Claims Agreement • June 24th, 2005 • Applied Micro Circuits Corp • Semiconductors & related devices • California

• Contract Type
  Release of Claims Agreement
• Filed
  June 24th, 2005
• Company
  Applied Micro Circuits Corp
• Industry
  Semiconductors & related devices
• Jurisdiction
  California

This Release of Claims Agreement (“Agreement”) is entered into by and between Thomas L. Tullie (“Executive”) and Applied Micro Circuits Corporation (“AMCC” or “Company”). This Agreement will not be effective until the date upon which the revocation period specified in Section 6(d) hereof has expired (the “Effective Date”).