CONFIDENTIAL TREATMENT REQUESTED WAFER MANUFACTURING AGREEMENTWafer Manufacturing Agreement • August 6th, 2004 • California Micro Devices Corp • Electronic components & accessories • California
This Wafer Manufacturing Agreement (this “Agreement”) is entered into by and between California Micro Devices Corporation, a corporation formed under the laws of, and with a place of business and office in, California USA (“CAMD”), and SANYO Electric Co., Ltd. Semiconductor Company, a corporation formed under the laws of, and with a place of business and an office in, Japan (“SANYO”) effective upon the later of the dates (the “Effective Date”) it is signed by a representative of each party under Authorized Signatures below .
LOAN MODIFICATION AGREEMENTLoan Modification Agreement • August 6th, 2004 • California Micro Devices Corp • Electronic components & accessories
This Loan Modification Agreement is entered into as of June 23, 2004 (the “Agreement”), by and between California Micro Devices Corporation (the “Borrower”) and Silicon Valley Bank (“Bank”).
