EUR700,000,000 TERM LOAN FACILITY AGREEMENTAgreement • August 5th, 2004 • Advanced Micro Devices Inc • Semiconductors & related devices
FIRST AMENDMENT TO AMENDED AND RESTATED TERM LOAN AGREEMENTTerm Loan Agreement • August 5th, 2004 • Advanced Micro Devices Inc • Semiconductors & related devices • New York
This FIRST AMENDMENT TO AMENDED AND RESTATED TERM LOAN AGREEMENT, dated as of March 29, 2004 (this “Amendment”), is entered into by and among FASL LLC, a Delaware limited liability company (the “Borrower”), GENERAL ELECTRIC CAPITAL CORPORATION, a Delaware corporation, as agent for itself and the lenders from time to time signatory to the Loan Agreement (as defined below), as hereinafter defined (the “Lenders”) (in its capacity as agent for itself and the Lenders, together with its successors or affiliates in such capacity, the “Agent”), and the Majority Lenders party hereto.
Agreement of Purchase and Sale of Limited Partner’s InterestsAdvanced Micro Devices Inc • August 5th, 2004 • Semiconductors & related devices
SECOND AMENDMENT TO AMENDED AND RESTATED LOAN AND SECURITY AGREEMENTLoan and Security Agreement • August 5th, 2004 • Advanced Micro Devices Inc • Semiconductors & related devices • California
This SECOND AMENDMENT TO AMENDED AND RESTATED LOAN AND SECURITY AGREEMENT (this “Amendment”) is entered into as of April 19, 2004, by and among ADVANCED MICRO DEVICES, INC., a Delaware corporation (“Parent”), AMD INTERNATIONAL SALES & SERVICE, LTD., a Delaware corporation (“AMDISS”) (Parent and AMDISS, individually and collectively, the “Borrower”), the several financial institutions party hereto as Lenders (each a “Lender” and, collectively, the “Lenders”), BANK OF AMERICA, N.A., as administrative agent for the Lenders (in such capacity, the “Agent”) and as a Lender, CONGRESS FINANCIAL CORPORATION (SOUTHWEST), as syndication agent for the Lenders (in its capacity as such, the “Syndication Agent”) and as a Lender, THE CIT GROUP/BUSINESS CREDIT, INC., as documentation agent for the Lenders (in its capacity as such, the “Documentation Agent”) and as a Lender, and WELLS FARGO FOOTHILL, LLC, as collateral agent for the Lenders (in its capacity as such, the “Collateral Agent”) and as a Lend
Agreement on the Formation of a Silent PartnershipAdvanced Micro Devices Inc • August 5th, 2004 • Semiconductors & related devices
On November 20, 2003, the Free State of Saxony (“Free State”), Advanced Micro Devices, Inc., Sunnyvale/USA (“AMD”) and M+W entered into a Cooperation Agreement in order to build a new production facility in Dresden (“Fab 36”) for the production of 300 mm silicon wafers on which integrated circuits, in particular, for microprocessors, are fabricated (“Wafer”). It is intended to undertake at the new production facility independent research and development to a considerable extent to develop to the industrial production stage semiconductor manufacturing technology, besides the production.
EUR 750,000,000 REVOLVING CREDIT AGREEMENT Dated April 21, 2004 among ADVANCED MICRO DEVICES, INC., AMD FAB 36 HOLDING GMBH, and AMD FAB 36 LIMITED LIABILITY COMPANY & CO. KGRevolving Credit Agreement • August 5th, 2004 • Advanced Micro Devices Inc • Semiconductors & related devices • New York
THIS REVOLVING CREDIT AGREEMENT (this “Agreement”), dated April 21, 2004, is made between ADVANCED MICRO DEVICES, INC., a corporation organised and existing under the laws of the State of Delaware, United States of America, with its chief executive office and principal place of business at One AMD Place, Sunnyvale, California 94088, United States of America (“AMD Inc.”), AMD FAB 36 HOLDING GMBH, Dresden, registered under HRB21270 in the Commercial Register kept at the Amstgericht Dresden County Court (“AMD Holding; and, together with AMD Inc., collectively, the “Sponsors”), and AMD FAB 36 LIMITED LIABILITY COMPANY & CO. KG, Dresden, registered under HRA5255 in the Commercial Register kept at the Amstgericht Dresden County Court (the “Company”).
To: SI Investment Limited Liability Company & Co. KG Attn. Hollis O’Brien Louis-Braille-Str. 5 01099 Dresden GermanyAdvanced Micro Devices Inc • August 5th, 2004 • Semiconductors & related devices
SI Investment Limited Liability Company & Co. KG (“Partnership”) is currently involved in the initial stages of a project pursuant to which it will use and develop to the industrial production stage semiconductor manufacturing technology and produce 300 mm silicon wafers, in particular, for microprocessors (the “Project”).
LICENSE AGREEMENT Dated April 21, 2004 between ADVANCED MICRO DEVICES, INC., AMD FAB 36 HOLDING GMBH, and AMD FAB 36 LIMITED LIABILITY COMPANY & CO. KGLicense Agreement • August 5th, 2004 • Advanced Micro Devices Inc • Semiconductors & related devices • California
AMD FAB 36 COST PLUS REIMBURSEMENT AGREEMENT between AMD FAB 36 HOLDING GMBH Wilschdorfer Landstr. 101, 01109 DresdenAdvanced Micro Devices Inc • August 5th, 2004 • Semiconductors & related devices
LIMITED PARTNERSHIP AGREEMENT of AMD Fab 36 Limited Liability Company & Co. KG (the “Partnership”)Limited Partnership Agreement • August 5th, 2004 • Advanced Micro Devices Inc • Semiconductors & related devices
The Leipziger Messe GmbH, the General Partner, Fab 36 Holding, Fab 36 Admin, M+W and the Second General Partner hereinafter collectively referred to as the “Partners”.
AMD FAB 36 HOLDING COST PLUS REIMBURSEMENT AGREEMENT between AMD FAB 36 HOLDING GMBH Wilschdorfer Landstr. 101, 01109 DresdenAdvanced Micro Devices Inc • August 5th, 2004 • Semiconductors & related devices
WHEREAS, AMD Fab 36 Holding holds a majority interest in AMD Fab 36 Limited Liability Company & Co. KG having its registered office in Dresden (“AMD Fab 36”). AMD Fab 36 Holding is in turn a wholly-owned Subsidiary of AMD Inc.;
Agreement of Purchase and Sale of Silent Partner’s InterestsAdvanced Micro Devices Inc • August 5th, 2004 • Semiconductors & related devices
On November 20, 2003, the Free State of Saxony (“Free State”), AMD Inc. and M+W entered into a Cooperation Agreement in order to build a new production facility in Dresden for the production of 300 mm silicon wafers on which integrated circuits, in particular, for microprocessors, are fabricated (“Wafer”). It is intended to undertake at the new production facility own research and development to a considerable extent to develop to the industrial production stage semiconductor manufacturing technology, besides the production.
Management Service AgreementManagement Service Agreement • August 5th, 2004 • Advanced Micro Devices Inc • Semiconductors & related devices
WHEREAS, M+W Zander Fünfte Verwaltungsgesellschaft mbH (“M+W”) and the Free State of Saxony will enter into a Cooperation Agreement pursuant to which a new factory (“Fab X”) for the production of wafers (“Wafer” means a 300 mm silicon wafer on which integrated circuits particularly for microprocessors are manufactured) is to be erected and operated in Dresden. In addition to the production of Wafers, own research and development to a considerable extent is to be conducted in the new factory in order to develop technology for the manufacture of semiconductors up to industrial production
GUARANTEE AGREEMENTGuarantee Agreement • August 5th, 2004 • Advanced Micro Devices Inc • Semiconductors & related devices
