0001181431-10-002735 Sample Contracts

REGISTRATION RIGHTS AGREEMENT

Registration Rights Agreement • January 12th, 2010 • Daystar Technologies Inc • Semiconductors & related devices • New York

• Contract Type
  Registration Rights Agreement
• Filed
  January 12th, 2010
• Company
  Daystar Technologies Inc
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

This REGISTRATION RIGHTS AGREEMENT (this "Agreement") is made as of the 6th day of January, 2010, between DayStar Technologies, Inc., a Delaware corporation (the "Company"), and the individual listed on Schedule I (the "Purchaser"). The Company and the Purchaser are sometimes referred to individually as a "Party" and collectively as the "Parties".

PURCHASE AGREEMENT

Purchase Agreement • January 12th, 2010 • Daystar Technologies Inc • Semiconductors & related devices • New York

• Contract Type
  Purchase Agreement
• Filed
  January 12th, 2010
• Company
  Daystar Technologies Inc
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

This Purchase Agreement (the "Agreement") is made as of the 6th day of January 2010 (the "Effective Date") between DayStar Technologies, Inc., a Delaware corporation (the "Company"), and Michael Moretti (the "Purchaser"). The Company and the Purchaser are sometimes referred to individually as a "Party" and collectively as the "Parties."

SECURITY AGREEMENT

Security Agreement • January 12th, 2010 • Daystar Technologies Inc • Semiconductors & related devices • New York

• Contract Type
  Security Agreement
• Filed
  January 12th, 2010
• Company
  Daystar Technologies Inc
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

This Security Agreement (this “Security Agreement”) is made effective as of January 6, 2010 (“Effective Date”), by and between DayStar Technologies, Inc., a Delaware corporation (“Debtor”), and Michael Moretti as beneficiary (“Secured Party”), with reference to the essential facts stated in the Recitals below.

INTERCREDITOR AGREEMENT

Intercreditor Agreement • January 12th, 2010 • Daystar Technologies Inc • Semiconductors & related devices

• Contract Type
  Intercreditor Agreement
• Filed
  January 12th, 2010
• Company
  Daystar Technologies Inc
• Industry
  Semiconductors & related devices

THIS INTERCREDITOR AGREEMENT (this "Agreement") dated as of the ____ day ___________, 20__, is made by and among ______________________, a _____________________ corporation/an individual ("Lender 1"), ____________, a _______________ corporation ("Lender 2""),_______________, a _______________corporation ("Lender 3"), _______________, a _______________corporation ("Lender 4"), _______________, a _______________corporation ("Lender 5"),and _______________, a _______________corporation ("Lender 6"), (Lender 1, Lender 2 Lender 3, Lender 4, Lender 5, and Lender 6 are sometimes referred to herein as the "Lenders").