FOURTH AMENDED AND RESTATED CREDIT FACILITY AGREEMENTCredit Facility Agreement • January 25th, 2013 • Iec Electronics Corp • Printed circuit boards • New York
This FOURTH AMENDED AND RESTATED CREDIT FACILITY AGREEMENT (this “Agreement”) is made as of January 18, 2013 by and among IEC ELECTRONICS CORP., a corporation formed under the laws of the State of Delaware (“Borrower”) and MANUFACTURERS AND TRADERS TRUST COMPANY (“Lender”), a New York banking corporation, with offices at 255 East Avenue, Rochester, New York 14604. This Agreement evidences in part obligations evidenced by, and amends and restates in its entirety the Third Amended and Restated Credit Facility Agreement made between the Borrower and Lender, dated as of December 17, 2010, as amended (“Prior Agreement”). All references to the Prior Agreement in any Loan Document made or delivered in connection with the Prior Agreement shall be deemed to be references to the Prior Agreement as amended and restated by this Agreement.
