WINTEGRA, INC. INDEMNIFICATION AGREEMENTIndemnification Agreement • June 9th, 2006 • Wintegra Inc • Semiconductors & related devices • Delaware
THIS AGREEMENT is entered into, effective as of _____________ by and between Wintegra, Inc., a Delaware corporation (the “Company”), and __________ (“Indemnitee”), effective as of the date that the Registration Statement on Form S-1 related to the initial public offering of the Company’s Common Stock is declared effective by the United States Securities and Exchange Commission.
AMENDMENT TO LOAN AGREEMENTLoan Agreement • June 9th, 2006 • Wintegra Inc • Semiconductors & related devices
This PLEDGE AND SECURITY AGREEMENT, dated as of June 4th, 2002 (this "Agreement"), by and among Wintegra Inc., a Delaware corporation (the "Grantor"), and Plenus Technologies Ltd., as Collateral Agreement ("Plenus" or "Collateral Agent").
Memorandum of UnderstandingWintegra Inc • June 9th, 2006 • Semiconductors & related devices
This Memorandum of Understanding describes the collaboration between Wintegra Ltd. and PMC-Sierra, Inc. on the design of an 8 port T1/E1 development kit that enables evaluation of the PM4358 COMET OCTAL device with the WinPath2 Development System. The 8 port T1/E1 development board which has been designed by PMC-Sierra is known as the ORBIT Daughter Board.
