MASTER AGREEMENT BETWEEN SIPEX CORPORATION And HANGZHOU SILAN MICROELECTRONICS CO., LTD. And HANGZHOU SILAN INTEGRATED CIRCUIT CO., LTD. DATED AS OF FEBRUARY 27, 2006Master Agreement • July 26th, 2006 • Sipex Corp • Semiconductors & related devices • Hong Kong
This Wafer Supply Agreement, including the Exhibits hereto (this "Agreement"), is entered into as of February 27, 2006 (the "Effective Date") by and between Sipex Corporation, a Delaware corporation with its principal place of business at 233 South Hillview Drive, Milpitas, CA 95053, U.S.A. ("Sipex") and Hangzhou Silan Integrated Circuit Co., Ltd., a China limited liability company with its principal place of business at No. 10 Road, East HETZ, Hangzhou (Xiasha), People's Republic of China, Postcode: 310018 ("Silan", together with Sipex, referred to individually as a "Party" and collectively as the "Parties").
