0001104659-20-066433 Sample Contracts

SETTLEMENT AGREEMENT AND RELEASE

Settlement Agreement and Release • May 27th, 2020 • Summit Wireless Technologies, Inc. • Semiconductors & related devices • New York

• Contract Type
  Settlement Agreement and Release
• Filed
  May 27th, 2020
• Company
  Summit Wireless Technologies, Inc.
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

This Confidential Settlement Agreement and Release (the “Settlement Agreement”) is made by and between Alexander Capital, L.P. (“ACLP”) on the one hand, and Summit Wireless Technology, Inc. (“WISA”) on the other hand. ACLP and WISA are each referred to as a “Party” and are collectively referred to as the “Parties.”

LEAK-OUT AGREEMENT

Leak-Out Agreement • May 27th, 2020 • Summit Wireless Technologies, Inc. • Semiconductors & related devices

• Contract Type
  Leak-Out Agreement
• Filed
  May 27th, 2020
• Company
  Summit Wireless Technologies, Inc.
• Industry
  Semiconductors & related devices

This agreement (the “Leak-Out Agreement”) is being delivered to you in connection with an understanding by and among Summit Wireless Technologies, Inc., a Delaware corporation (the “Company”), and Alexander Capital, L.P. (the “Holder”).