AGREEMENT FOR WAFER PRODUCTIONAgreement for Wafer • June 28th, 2005 • Advanced Power Technology Inc • Semiconductors & related devices • Hong Kong
This Agreement (“Agreement”) is entered into on June 22, 2005 by Advanced Power Technology, Inc.; a Delaware Corporation with headquarters located at 405 SW Columbia Street in Bend, Oregon, USA (hereinafter referred to as “APT”)
