LOAN AND SECURITY AGREEMENT BY AND AMONG SILICON VALLEY BANK as Bank AND 3D SYSTEMS CORPORATION and 3D SYSTEMS INC. as BorrowersLoan and Security Agreement • August 5th, 2004 • 3d Systems Corp • Services-prepackaged software
This LOAN AND SECURITY AGREEMENT dated as of June 30, 2004 among SILICON VALLEY BANK (“Bank”), whose address is 3003 Tasman Drive, Santa Clara, California 95054, 3D SYSTEMS CORPORATION, a Delaware corporation (the “Company”), and its Subsidiary, 3D SYSTEMS, Inc., a California corporation (“3D California”) (the Company and 3D California are sometimes referred to herein individually as a “Borrower” and collectively, jointly and severally, as the “Borrowers”), whose address is 26081 Avenue Hall, Valencia, CA 91355 provides the terms on which Bank will lend to Borrowers and Borrowers will repay Bank. The parties agree as follows:
