LOAN AGREEMENT (this "Agreement") between Infineon Technologies Holding B.V., Rotterdam (the "Issuer") and Infineon Technologies AG, Munich ("Infineon Technologies AG")Infineon Technologies Ag • November 21st, 2003 • Semiconductors & related devices
SUBORDINATED GUARANTEE by Infineon Technologies AG Munich, Federal Republic of Germany (the "Guarantor") in favour of the holders of the 5% Guaranteed Subordinated Convertible Notes of 2003/2010 in the aggregate principal amount of €700,000,000 (the...Infineon Technologies Ag • November 21st, 2003 • Semiconductors & related devices
The Guarantor hereby, subject to § 7(5) through § 7(12) of the Conditions of the Issue of the Notes (the "Conditions") and the provisions below, unconditionally and irrevocably guarantees to the Noteholders (which expression shall, for the purposes of this Subordinated Guarantee, include any Noteholders under any additional Notes issued by the Issuer under § 20 of the Conditions the due and punctual payment in accordance with the Conditions of any and all sums expressed to be payable by the Issuer under the Notes.
ASSIGNMENT AGREEMENTInfineon Technologies Ag • November 21st, 2003 • Semiconductors & related devices
Confidential Materials omitted and filed separately with the Securities and Exchange Commission. Asterisks denote such ommissions. Amendment 1 to Shareholder Agreement of Altis Semiconductor between Infineon Technologies Holding France and Compagnie...Participation Agreement • November 21st, 2003 • Infineon Technologies Ag • Semiconductors & related devices
WHEREAS Infineon and IBM acknowledge that IBM has agreed to participate in the Process Development Projects pursuant to the 3-Way Agreement with Chartered Semiconductor executed contemporaneously herewith, and Infineon is agreeing to take on capacity obligations in the Company as specified in this Amendment 1,
