0001035704-99-000142 Sample Contracts

AMONG THE DII GROUP, INC. AND THE SUBSIDIARY BORROWERS FROM TIME TO TIME PARTIES HERETO,
Credit Agreement • March 19th, 1999 • Dii Group Inc • Electronic components & accessories • New York
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RECITALS
Employment Agreement • March 19th, 1999 • Dii Group Inc • Electronic components & accessories • Colorado
AMONG MULTILAYER TECHNOLOGY GMBH & CO. KG, AS BORROWER,
Credit Agreement • March 19th, 1999 • Dii Group Inc • Electronic components & accessories • New York
RECITALS
Employment and Deferred Compensation Agreement • March 19th, 1999 • Dii Group Inc • Electronic components & accessories • Colorado
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