between GLOBAL TECHNOLOGY INC. as Borrower and CHINA CONSTRUCTION BANK - NINGBO YINZHOU BRANCH as Lender RMB WORKING CAPITAL LOAN AGREEMENTRMB Loan Agreement • March 6th, 2014 • Applied Optoelectronics, Inc. • Semiconductors & related devices
GLOBAL TECHNOLOGY INC.RMB Working Capital Loan Agreement • March 6th, 2014 • Applied Optoelectronics, Inc. • Semiconductors & related devices
This RMB Loan Agreement (the “Contract”) is entered into in order for the company’s daily operation expense [, including material purchase payment and employee’s salary], by and between:
Credit Facility Agreement of Mega International Commercial BankCredit Facility Agreement • March 6th, 2014 • Applied Optoelectronics, Inc. • Semiconductors & related devices
Applied Optoelectronics, Inc., Taiwan Branch (the “Borrower”) and Mega International Commercial Bank (the “Bank”) hereby agree that the Borrower shall be bound by the following terms and conditions for all the credit granting transactions with the Bank.
General Credit Facility AgreementGeneral Credit Facility Agreement • March 6th, 2014 • Applied Optoelectronics, Inc. • Semiconductors & related devices • New Taipei
The undersigned, Applied Optoelectronics, Inc., Taiwan Branch. (hereinafter “Borrower”) and it guarantor (hereinafter “Guarantor”, together with the Borrower, the "Undersigned") hereby agree to the terms and conditions set forth below in addition to the General Loan Agreement, Letter of Guarantee and other signed instruments with respect to the credit facility extended by E. Sun Commercial Bank, Ltd. (hereinafter “Bank”):
