0001012870-02-001606 Sample Contracts

EXHIBIT 10.51 Bump Chip Carrier (called "BCC" in this Agreement) License Agreement Administrative Amendment ------------------------ This administrative amendment made and entered into as of the 5th day of March, 2002, by and between: FUJITSU LIMITED,...
Chippac Inc • April 1st, 2002 • Semiconductors & related devices
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WITNESSETH THAT:
License Agreement • April 1st, 2002 • Chippac Inc • Semiconductors & related devices
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RECITALS
License Agreement • April 1st, 2002 • Chippac Inc • Semiconductors & related devices • California
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EXHIBIT 10.47 [Translation] PATENT AND TECHNOLOGY LICENSE AGREEMENT This Patent and Technology License Agreement (the "Agreement") is made and entered into as of August 5, 1999 (hereinafter "Effective Date") by and between Hyundai Electronics...
Patent and Technology License Agreement • April 1st, 2002 • Chippac Inc • Semiconductors & related devices
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An
Terms of Agreement • April 1st, 2002 • Chippac Inc • Semiconductors & related devices • California
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RECITALS
License Agreement • April 1st, 2002 • Chippac Inc • Semiconductors & related devices • California
Sample 1
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