SEPARATION AGREEMENT AND RELEASESeparation Agreement and Release • February 28th, 2007 • Applied Materials Inc /De • Semiconductors & related devices • California
This Separation Agreement and Release (“Agreement”) is made by and between Nancy H. Handel (“Employee”) and Applied Materials, Inc. (the “Company”) (collectively referred to as the “Parties” or individually referred to as a “Party”).
U.S. $1,000,000,000 CREDIT AGREEMENT Dated as of January 26, 2007 Among APPLIED MATERIALS, INC. as Borrower and THE INITIAL LENDERS NAMED HEREIN as Initial Lenders CITICORP USA, INC. as Administrative Agent THE BANK OF TOKYO-MITSUBISHI UFJ, LTD.,...Credit Agreement • February 28th, 2007 • Applied Materials Inc /De • Semiconductors & related devices • New York
APPLIED MATERIALS, INC., a Delaware corporation (the “Borrower”), the banks, financial institutions and other institutional lenders (the “Initial Lenders”) listed on the signature pages hereof, and CITICORP USA, INC. (“CUSA”), as agent (the “Agent”) for the Lenders (as hereinafter defined), agree as follows:
