Exhibit 1.1 UNDERWRITING AGREEMENTUnderwriting Agreement • November 2nd, 1998 • Armstrong World Industries Inc • Plastics products, nec
We (the "Manager") are acting on behalf of the underwriter or underwriters (including ourselves) named below (such underwriter or underwriters being herein called the "Underwriters"), and we understand that Armstrong World Industries, Inc., a Pennsylvania corporation (the "Company"), proposes to issue and sell $180,000,000 aggregate initial offering price of 7.45% Senior Quarterly Interest Bonds due October 15, 2038 (the "Debt Securities"). The Debt Securities are also referred to herein as the Offered Securities. The Debt Securities will be issued pursuant to the provisions of an Indenture dated as of August 6, 1996 (the "Indenture") between the Company and The Chase Manhattan Bank, formerly known as Chemical Bank, as successor to Mellon Bank, N.A., as Trustee (the "Trustee"), as amended.
Exhibit 1.3 ARMSTRONG WORLD INDUSTRIES, INC. UNDERWRITING AGREEMENT STANDARD PROVISIONS (DEBT SECURITIES AND PREFERRED STOCK)Armstrong World Industries Inc • November 2nd, 1998 • Plastics products, nec • New York
Exhibit 4.4 THIS SECURITY IS A GLOBAL SECURITY WITHIN THE MEANING OF THE INDENTURE HEREINAFTER REFERRED TO AND IS REGISTERED IN THE NAME OF A DEPOSITARY OR A NOMINEE THEREOF. THIS SECURITY MAY NOT BE EXCHANGED IN WHOLE OR IN PART FOR A SECURITY...Armstrong World Industries Inc • November 2nd, 1998 • Plastics products, nec
