0000950123-10-022556 Sample Contracts

AGREEMENT AND PLAN OF MERGER among: Applied Materials, Inc., a Delaware corporation; Jupiter Acquisition Sub, Inc., a Montana corporation; and Semitool, Inc., a Montana corporation Dated as of November 16, 2009

Agreement and Plan of Merger • March 9th, 2010 • Applied Materials Inc /De • Semiconductors & related devices • Montana

• Contract Type
  Agreement and Plan of Merger
• Filed
  March 9th, 2010
• Company
  Applied Materials Inc /De
• Industry
  Semiconductors & related devices
• Jurisdiction
  Montana

This Agreement and Plan of Merger (“Agreement”) is made and entered into as of November 16, 2009, by and among: Applied Materials, Inc., a Delaware corporation (“Parent”); Jupiter Acquisition Sub, Inc., a Montana corporation and a wholly owned subsidiary of Parent (“Acquisition Sub”); and Semitool, Inc., a Montana corporation (the “Company”). Certain capitalized terms used in this Agreement are defined in Exhibit A.