0000950123-09-040145 Sample Contracts

AMENDMENT NO. 1 TO THE CREDIT AGREEMENT

The Credit Agreement • September 1st, 2009 • Applied Materials Inc /De • Semiconductors & related devices • New York

• Contract Type
  The Credit Agreement
• Filed
  September 1st, 2009
• Company
  Applied Materials Inc /De
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

AMENDMENT NO. 1 TO THE CREDIT AGREEMENT among APPLIED MATERIALS, INC., a Delaware corporation (the “Borrower”), the banks, financial institutions and other institutional lenders parties to the Credit Agreement referred to below (collectively, the “Lenders”) and Citicorp USA, Inc., as agent (the “Agent”) for the Lenders.