AMENDED AND RESTATED LOAN, GUARANTY AND SECURITY AGREEMENT Dated as of March 16, 2012Loan, Guaranty and Security Agreement • May 1st, 2012 • Sanmina-Sci Corp • Printed circuit boards • New York
THIS AMENDED AND RESTATED LOAN, GUARANTY AND SECURITY AGREEMENT (this “Agreement”) is dated as of March 16, 2012, among SANMINA-SCI CORPORATION, a Delaware corporation (“Sanmina”), HADCO CORPORATION, a Massachusetts corporation (“Hadco”), HADCO SANTA CLARA, INC., a Delaware corporation (“Hadco Santa Clara”), SANMINA‑SCI SYSTEMS HOLDINGS, INC., a Delaware corporation (“SSCI Holdings”), and SCI TECHNOLOGY, INC., an Alabama corporation (“SCI Technology” and together with Sanmina, Hadco, Hadco Santa Clara and SSCI Holdings, collectively, “Borrowers”), SANMINA-SCI SYSTEMS (CANADA) INC., a Nova Scotia limited company, and SCI BROCKVILLE CORP., a Nova Scotia unlimited company, each as a Designated Canadian Guarantor, the financial institutions party to this Agreement from time to time as lenders (collectively, “Lenders”), and BANK OF AMERICA, N.A., a national banking association, as agent for the Lenders (“Agent”).
