INTEGRATED PACKAGING ASSEMBLY CORPORATION AND OSE, INC.Loan and Security Agreement • March 30th, 2001 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
Exhibit 10.39 CHANGE IN TERMS AGREEMENTChange in Terms Agreement • March 30th, 2001 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
-------------------------------------------------------------------------------- References in the shaded area are for Lender's use only and do not limit the applicability of this document to any particular loan or item. Any item above containing "*****" has been omitted due to text length limitations. --------------------------------------------------------------------------------
Exhibit 10.42 CHANGE IN TERMS AGREEMENTBusiness Loan Agreement • March 30th, 2001 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
THIS BUSINESS LOAN AGREEMENT dated November 29, 2000, is made and executed between Integrated Packaging Assembly Corporation; and OSE, Inc. ("Borrower") and Bank SinoPac, Los Angeles Branch ("Lender") on the following terms and conditions. Borrower has received prior commercial loans from Lender or has applied to Lender for a commercial loan or loans or other financial accommodations, including those which may be described on any exhibit or schedule attached to this Agreement ("Loan"). Borrower understands and agrees that: (A) in granting, renewing, or extending any Loan, Lender is relying upon Borrower's representations, warranties, and agreements as set forth in this Agreement, and (B) all such Loans shall be and remain subject to the terms and conditions of this Agreement.
