SUNPOWER CORPORATION FORM OF RETENTION AGREEMENTForm of Retention Agreement • August 9th, 2011 • Sunpower Corp • Semiconductors & related devices • California
This Retention Agreement (this “Agreement”) is entered into by and between SunPower Corporation, a Delaware corporation (the “Company”), and [name] (“Executive” and, together with the Company, the “Parties”), effective as of and contingent upon the Offer Closing (as defined below).
AMENDMENT NO. 1 Dated as of May 25, 2011 to EUR 75,000,000 REVOLVING CREDIT AGREEMENT Dated as of November 23, 2010 among SUNPOWER CORPORATION as Parent and SUNPOWER CORPORATION MALTA HOLDINGS LIMITED as Borrower and SOCIÉTÉ GÉNÉRALE, MILAN BRANCH as...Revolving Credit Agreement • August 9th, 2011 • Sunpower Corp • Semiconductors & related devices
This Amendment No. 1 to the Revolving Credit Agreement (this “Amendment”) is dated as of May 25, 2011 and entered into among SUNPOWER CORPORATION, a Delaware Corporation (the “Parent”), SUNPOWER CORPORATION MALTA HOLDINGS LIMITED, a limited liability company registered under the laws of Malta (registration number C41439) with registered office at Suite 1, Level 2, Forni Complex, Valletta Waterfront, Pinto Wharf, Floriana FRN 1913, Malta (the “Borrower”) and Société Générale, Milan Branch, a company incorporated as a société anonyme under the laws of France, having its registered office at Boulevard Haussmann 29, 75009 Paris, with a fully paid-up corporate capital of EUR 933,027,038.75 (nine hundred and thirty-three million twenty-seven thousand and thirty-eight/75), which acts for the purposes hereof through its Italian branch, whose offices are located in Via Olona 2, Milan, tax code and registration number at the Companies Registry of Milan No. 80112150158, enrolled in the register o
NEW BANK JOINDER AGREEMENTNew Bank Joinder Agreement • August 9th, 2011 • Sunpower Corp • Semiconductors & related devices • New York
NEW BANK JOINDER AGREEMENT, dated as of May 27, 2011 (as it may be amended, supplemented or otherwise modified from time to time, this "Agreement"), among SUNPOWER CORPORATION, a Delaware corporation (the "Company"), DEUTSCHE BANK AG NEW YORK BRANCH, as Administrative Agent and as Issuing Bank (in such capacities, respectively, the "Administrative Agent" and the "Issuing Bank"), and Credit Agricole Corporate and Investment Bank, as a new Bank (the "New Bank").
SECOND SHARE KUN-PLEDGE AGREEMENTSecond Share Kun-Pledge Agreement • August 9th, 2011 • Sunpower Corp • Semiconductors & related devices
FIRST SUPPLEMENT TO LOAN AGREEMENT Between CALIFORNIA ENTERPRISE DEVELOPMENT AUTHORITY and SUNPOWER CORPORATION, as Borrower Dated as of June 1, 2011 Relating to California Enterprise Development Authority Recovery Zone Facility Revenue Bonds...Loan Agreement • August 9th, 2011 • Sunpower Corp • Semiconductors & related devices
This FIRST SUPPLEMENT TO LOAN AGREEMENT (this “First Supplement”) dated as of June 1, 2011, supplements and amends that certain LOAN AGREEMENT (the “Loan Agreement”) entered into as of December 1, 2010, by and between the CALIFORNIA ENTERPRISE DEVELOPMENT AUTHORITY (the “Issuer”), a public entity duly organized and validly existing under the laws of the State of California, and SUNPOWER CORPORATION, a Delaware corporation (the “Borrower”).
THIRD AMENDMENT TO CREDIT AGREEMENTCredit Agreement • August 9th, 2011 • Sunpower Corp • Semiconductors & related devices • California
This Third Amendment to Credit Agreement (this “Amendment”), is entered into as of May 11, 2011 (the “Third Amendment Effective Date”), by and among SunPower Corporation, a Delaware corporation (the “Borrower”), SunPower Corporation, Systems, a Delaware corporation (“SCS”), SunPower North America, LLC, a Delaware limited liability company (together with SCS, each a “Guarantor,” and collectively, the “Guarantors”; the Borrower and the Guarantors being referred to herein, individually, as a “Loan Party” and collectively, as the “Loan Parties”), Union Bank, N.A., as administrative agent for the Lenders (as defined below) (in such capacity, the “Agent”), and the several financial institutions from time to time party to the Credit Agreement (as defined below) as lenders (the “Lenders”).
SECOND AMENDMENT TO CREDIT AGREEMENTCredit Agreement • August 9th, 2011 • Sunpower Corp • Semiconductors & related devices • California
This Second Amendment to Credit Agreement (this “Amendment”), is entered into as of April 29, 2011 (the “Second Amendment Effective Date”), by and among SunPower Corporation, a Delaware corporation (the “Borrower”), SunPower Corporation, Systems, a Delaware corporation (“SCS”), SunPower North America, LLC, a Delaware limited liability company (together with SCS, each a “Guarantor,” and collectively, the “Guarantors”; the Borrower and the Guarantors being referred to herein, individually, as a “Loan Party” and collectively, as the “Loan Parties”), Union Bank, N.A., as administrative agent for the Lenders (as defined below) (in such capacity, the “Agent”), and the several financial institutions from time to time party to the Credit Agreement (as defined below) as lenders (the “Lenders”).
FIRST AMENDMENT AND CONSENT TO CREDIT AGREEMENTCredit Agreement • August 9th, 2011 • Sunpower Corp • Semiconductors & related devices • California
This First Amendment and Consent to Credit Agreement (this “Amendment”), is entered into as of April 19, 2011 (the “First Amendment Effective Date”), by and among SunPower Corporation, a Delaware corporation (the “Borrower”), SunPower Corporation, Systems, a Delaware corporation (“SCS”), SunPower North America, LLC, a Delaware limited liability company (together with SCS, each a “Guarantor,” and collectively, the “Guarantors”; the Borrower and the Guarantors being referred to herein, individually, as a “Loan Party” and collectively, as the “Loan Parties”), Union Bank, N.A., as administrative agent for the Lenders (as defined below) (in such capacity, the “Agent”), and the several financial institutions from time to time party to the Credit Agreement (as defined below) as lenders (the “Lenders”).
