0000867773-11-000015 Sample Contracts

CREDIT SUPPORT AGREEMENT
Credit Support Agreement • May 12th, 2011 • Sunpower Corp • Semiconductors & related devices • New York

This CREDIT SUPPORT AGREEMENT (together with any Exhibits and Schedules attached hereto, as the same may be amended from time to time in accordance with the terms hereof, this “Agreement”), dated as of April 28, 2011, is entered into by and between SunPower Corporation, a Delaware corporation (the “Company”), and Total S.A., a société anonyme organized under the laws of the Republic of France (the “Guarantor”).

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AFFILIATION AGREEMENT BY AND BETWEEN TOTAL GAS & POWER USA, SAS AND SUNPOWER CORPORATION
Rights Agreement • May 12th, 2011 • Sunpower Corp • Semiconductors & related devices • Delaware

This Affiliation Agreement (hereinafter the “Agreement”) is made as of April 28, 2011, by and between Total Gas & Power USA, SAS, a société par actions simplifiée organized under the laws of the Republic of France (“Terra”) and SunPower Corporation, a Delaware corporation (the “Company”).

TENDER OFFER AGREEMENT BY AND BETWEEN TOTAL GAS & POWER USA, SAS AND SUNPOWER CORPORATION Dated as of April 28, 2011
Tender Offer Agreement • May 12th, 2011 • Sunpower Corp • Semiconductors & related devices • Delaware

THIS TENDER OFFER AGREEMENT (this “Agreement”) is made and entered into as of April 28, 2011, by and between Total Gas & Power USA, SAS, a société par actions simplifiée organized under the laws of the Republic of France (“Parent”), and SunPower Corporation, a Delaware corporation (the “Company”). All capitalized terms that are used in this Agreement shall have the respective meanings ascribed thereto in Article I.

REGISTRATION RIGHTS AGREEMENT April 28, 2011
Registration Rights Agreement • May 12th, 2011 • Sunpower Corp • Semiconductors & related devices • Delaware

This REGISTRATION RIGHTS AGREEMENT (this “Agreement”) is dated as of April 28, 2011, by and between SunPower Corporation, a Delaware corporation (the “Company”), on the one hand, and Total Gas & Power USA, SAS (“Total G&P”), a société par actions simplifiée organized under the laws of the Republic of France, on the other hand.

RESEARCH & COLLABORATION AGREEMENT by and between TOTAL GAS & POWER USA, SAS and SUNPOWER CORPORATION dated April 28, 2011
Research & Collaboration Agreement • May 12th, 2011 • Sunpower Corp • Semiconductors & related devices • New York

This RESEARCH & COLLABORATION AGREEMENT (this “Agreement”), dated as of April 28, 2011 (the “Execution Date”) and effective upon the occurrence of the Offer Closing (as defined in the Tender Offer Agreement) (the date of the occurrence of the Offer Closing, the “Effective Date”), is entered in by and between Total Gas & Power USA, SAS, a société par actions simplifiée organized under the laws of the Republic of France with an address at 2, place Jean Millier, La Défense 6, 92400 Courbevoie, France (“Total G&P”) and SunPower Corporation, a Delaware corporation, with an address at 77 Rio Robles, San Jose, California 95314 (“SunPower”). Each of Total G&P and SunPower are hereinafter referred to as a “Party,” and collectively, the “Parties.”

AMENDMENT NO. 3 TO INGOT SUPPLY AGREEMENT
Confidential Treatment • May 12th, 2011 • Sunpower Corp • Semiconductors & related devices

THIS AMENDMENT NO. 3 INGOT SUPPLY AGREEMENT (This "Amendment No. 3") is made this 1st day of February 2011 ("Effective Date") by and between Woongjin Energy Co., Ltd., a company organized and existing under the laws of the Republic of Korea with its office located at 1316 GwanPyeong-Dong, YuSung-Gu, DaeJeon, Korea (“Supplier”), and SunPower Corporation, a company organized under the laws of the State of Delaware, United States of America, with its principal office located at 3939 North First Street, San Jose, California 95134, United states of America (“Purchaser”). Each of Supplier and Purchaser is sometimes referred to herein as a "Party" and collectively, as the "Parties". Capitalized terms used in this Amendment No. 3 and not defined herein shall have the meaning given to such terms in the Agreement (as hereinafter defined).

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