Common Contracts
2 similar Supplemental Indenture contracts by Avago Technologies Japan, Ltd.
SUPPLEMENTAL INDENTURE NO. 2Supplemental Indenture • January 8th, 2007 • Avago Technologies Japan, Ltd. • Semiconductors & related devices • New York
Supplemental Indenture No. 2 (this “Supplemental Indenture”), dated as of January 3, 2007, among Avago Technologies Finance Pte. Ltd., a private limited company organized under the laws of the Republic of Singapore, Avago Technologies U.S. Inc., a Delaware corporation, Avago Technologies Wireless (U.S.A.) Manufacturing Inc., a Delaware corporation (collectively, the “Issuers”), the Guarantors signatory hereto and The Bank of New York, as trustee (the “Trustee”).
SUPPLEMENTAL INDENTURE NO. 2Supplemental Indenture • January 8th, 2007 • Avago Technologies Japan, Ltd. • Semiconductors & related devices • New York
Supplemental Indenture No. 2 (this “Supplemental Indenture”), dated as of January 3, 2007, among Avago Technologies Finance Pte. Ltd., a private limited company organized under the laws of the Republic of Singapore, Avago Technologies U.S. Inc., a Delaware corporation, Avago Technologies Wireless (U.S.A.) Manufacturing Inc., a Delaware corporation (collectively, the “Issuers”), the Guarantors signatory hereto and The Bank of New York, as trustee (the “Trustee”).
