Common Contracts
5 similar Tender and Voting Agreement contracts by California Micro Devices Corp, On Semiconductor Corp, Intersil Corp/De
FORM OF TENDER AND VOTING AGREEMENTTender and Voting Agreement • March 22nd, 2010 • Intersil Corp/De • Semiconductors & related devices • Delaware
THIS TENDER AND VOTING AGREEMENT (this “Agreement”) dated March 22, 2010, among INTERSIL CORPORATION, a Delaware corporation (“Parent”); NAVAJO MERGER SUB, INC., a Delaware corporation and an indirect wholly-owned subsidiary of Parent (“Purchaser”); TECHWELL, INC., a Delaware corporation (the “Company”) (only with respect to Section 6 and Section 11 hereof and as a third party beneficiary of Section 4(f) hereof); and the undersigned stockholder of the Company (“Stockholder”).
FORM OF TENDER AND VOTING AGREEMENTTender and Voting Agreement • December 15th, 2009 • California Micro Devices Corp • Electronic components & accessories • Delaware
This TENDER AND VOTING AGREEMENT (this “Agreement”) dated December , 2009, among ON Semiconductor Corporation, a Delaware corporation (“Parent”); Pac-10 Acquisition Corporation, a Delaware corporation and an indirect wholly-owned subsidiary of Parent (“Purchaser”); California Micro Devices Corporation, a Delaware corporation (the “Company”) (only with respect to Section 6 and Section 10 hereof and as a third party beneficiary of Section 4(f) hereof); and the undersigned stockholder of the Company (“Stockholder”).
FORM OF TENDER AND VOTING AGREEMENTTender and Voting Agreement • December 15th, 2009 • California Micro Devices Corp • Electronic components & accessories • Delaware
This TENDER AND VOTING AGREEMENT (this “Agreement”) dated December , 2009, among ON Semiconductor Corporation, a Delaware corporation (“Parent”); Pac-10 Acquisition Corporation, a Delaware corporation and an indirect wholly-owned subsidiary of Parent (“Purchaser”); California Micro Devices Corporation, a Delaware corporation (the “Company”) (only with respect to Section 6 and Section 10 hereof and as a third party beneficiary of Section 4(f) hereof); and the undersigned stockholder of the Company (“Stockholder”).
FORM OF TENDER AND VOTING AGREEMENTTender and Voting Agreement • December 14th, 2009 • On Semiconductor Corp • Semiconductors & related devices • Delaware
This TENDER AND VOTING AGREEMENT (this “Agreement”) dated December 14, 2009, among ON Semiconductor Corporation, a Delaware corporation (“Parent”); Pac-10 Acquisition Corporation, a Delaware corporation and an indirect wholly-owned subsidiary of Parent (“Purchaser”); California Micro Devices Corporation, a Delaware corporation (the “Company”) (only with respect to Section 6 and Section 10 hereof and as a third party beneficiary of Section 4(f) hereof); and the undersigned stockholder of the Company (“Stockholder”).
FORM OF TENDER AND VOTING AGREEMENTTender and Voting Agreement • December 14th, 2009 • On Semiconductor Corp • Semiconductors & related devices • Delaware
This TENDER AND VOTING AGREEMENT (this “Agreement”) dated December 14, 2009, among ON Semiconductor Corporation, a Delaware corporation (“Parent”); Pac-10 Acquisition Corporation, a Delaware corporation and an indirect wholly-owned subsidiary of Parent (“Purchaser”); California Micro Devices Corporation, a Delaware corporation (the “Company”) (only with respect to Section 6 and Section 10 hereof and as a third party beneficiary of Section 4(f) hereof); and the undersigned stockholder of the Company (“Stockholder”).
