Common Contracts
2 similar Joinder and Amendment Agreement contracts by NXP Semiconductors N.V.
EX-4.9 3 d308226dex49.htm JOINDER AND AMENDMENT AGREEMENT DATED NOVEMBER 18, 2011 JOINDER AND AMENDMENT AGREEMENTJoinder and Amendment Agreement • May 5th, 2020 • New York
AGREEMENT (this “Agreement”) dated as of November 18, 2011 relating to the Credit Agreement dated as of March 4, 2011 (the “Credit Agreement”) among NXP B.V., with its corporate seat in Eindhoven, the Netherlands (the “Company”), NXP FUNDING LLC (the “Co-Borrower”), the lending institutions from time to time parties thereto, Barclays Bank PLC, as Administrative Agent (in such capacity, the “Administrative Agent”), Morgan Stanley Senior Funding, Inc., as Global Collateral Agent, and Mizuho Corporate Bank, Ltd., as Taiwan Collateral Agent.
JOINDER AND AMENDMENT AGREEMENTJoinder and Amendment Agreement • March 13th, 2012 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
AGREEMENT (this “Agreement”) dated as of November 18, 2011 relating to the Credit Agreement dated as of March 4, 2011 (the “Credit Agreement”) among NXP B.V., with its corporate seat in Eindhoven, the Netherlands (the “Company”), NXP FUNDING LLC (the “Co-Borrower”), the lending institutions from time to time parties thereto, Barclays Bank PLC, as Administrative Agent (in such capacity, the “Administrative Agent”), Morgan Stanley Senior Funding, Inc., as Global Collateral Agent, and Mizuho Corporate Bank, Ltd., as Taiwan Collateral Agent.
