AGREEMENT AND PLAN OF MERGER dated as of October 24, 2006 among POWERDSINE LTD. MICROSEMI CORPORATION and PINNACLE ACQUISITION CORPORATION LTDMerger Agreement • November 21st, 2006 • Powerdsine LTD • Communications equipment, nec • Delaware
Contract Type FiledNovember 21st, 2006 Company Industry JurisdictionAGREEMENT AND PLAN OF MERGER (this “Agreement”) dated as of October 24, 2006 among PowerDsine Ltd., an Israeli company (the “Company”), Microsemi Corporation, a Delaware corporation (“Parent”), and Pinnacle Acquisition Corporation Ltd, an Israeli company and a wholly owned subsidiary of Parent (“Merger Subsidiary”).
AGREEMENT AND PLAN OF MERGER dated as of October 24, 2006 among POWERDSINE LTD. MICROSEMI CORPORATION and PINNACLE ACQUISITION CORPORATION LTDMerger Agreement • October 30th, 2006 • Microsemi Corp • Semiconductors & related devices • Delaware
Contract Type FiledOctober 30th, 2006 Company Industry JurisdictionAGREEMENT AND PLAN OF MERGER (this “Agreement”) dated as of October 24, 2006 among PowerDsine Ltd., an Israeli company (the “Company”), Microsemi Corporation, a Delaware corporation (“Parent”), and Pinnacle Acquisition Corporation Ltd, an Israeli company and a wholly owned subsidiary of Parent (“Merger Subsidiary”).
AGREEMENT AND PLAN OF MERGER dated as of October 24, 2006 among POWERDSINE LTD. MICROSEMI CORPORATION and PINNACLE ACQUISITION CORPORATION LTDMerger Agreement • October 26th, 2006 • Powerdsine LTD • Communications equipment, nec • Delaware
Contract Type FiledOctober 26th, 2006 Company Industry JurisdictionAGREEMENT AND PLAN OF MERGER (this “Agreement”) dated as of October 24, 2006 among PowerDsine Ltd., an Israeli company (the “Company”), Microsemi Corporation, a Delaware corporation (“Parent”), and Pinnacle Acquisition Corporation Ltd, an Israeli company and a wholly owned subsidiary of Parent (“Merger Subsidiary”).