Common Contracts
3 similar null contracts by NXP Manufacturing (Thailand) Co., Ltd., NXP Semiconductors N.V.
NXP B.V. NXP FUNDING LLC as Issuers EACH OF THE GUARANTORS PARTY HERETO DEUTSCHE BANK TRUST COMPANY AMERICAS, as Trustee MORGAN STANLEY SENIOR FUNDING, INC., as Global Collateral Agent and MIZUHO CORPORATE BANK, LTD., as Taiwan Collateral AgentNXP Semiconductors N.V. • July 22nd, 2010 • Semiconductors & related devices • New York
INDENTURE dated as of July 20, 2010, among NXP B.V. (the “Company”), NXP Funding LLC (the “Co-Issuer” and, together with the Company, the “Issuers”), the Guarantors (as defined herein), Deutsche Bank Trust Company Americas, as trustee (the “Trustee”), Morgan Stanley Senior Funding, Inc., as global collateral agent (the “Global Collateral Agent”), and Mizuho Corporate Bank, Ltd., as Taiwan collateral agent (the “Taiwan Collateral Agent”).
NXP B.V. NXP FUNDING LLC IssuersNXP Manufacturing (Thailand) Co., Ltd. • April 23rd, 2007 • New York
INDENTURE dated as of October 12, 2006, among NXP B.V. (the “Company”), NXP Funding LLC (the “Co-Issuer” and, together with the Company, the “Issuers”), the Guarantors (as defined herein) and Deutsche Bank Trust Company Americas, as trustee (the “Trustee”).
NXP B.V. NXP FUNDING LLC IssuersNXP Manufacturing (Thailand) Co., Ltd. • April 23rd, 2007 • New York
INDENTURE dated as of October 12, 2006, among NXP B.V. (the “Company”), NXP Funding LLC (the “Co-Issuer” and, together with the Company, the “Issuers”), the Guarantors (as defined herein), Deutsche Bank Trust Company Americas, as trustee (the “Trustee”), Morgan Stanley Senior Funding, Inc., as Global Collateral Agent, and Mizuho Corporate Bank, Ltd., as Taiwan Collateral Agent.
