75,000,000 REDUCING REVOLVING CREDIT FACILITY $2,000,000 LETTER OF CREDIT FACILITY CREDIT AGREEMENT by and among PARK ELECTROCHEMICAL CORP., as Borrower, THE GUARANTORS PARTY HERETO, and HSBC BANK USA, NATIONAL ASSOCIATION, as Lender Dated: as of...Credit Agreement • May 13th, 2016 • Park Electrochemical Corp • Printed circuit boards
Contract Type FiledMay 13th, 2016 Company IndustryTHIS CREDIT AGREEMENT (as hereafter amended, modified, supplemented or restated, this “Agreement”) is dated as of January 15, 2016 and effective as of January 21, 2016 and is made by and among PARK ELECTROCHEMICAL CORP., a New York corporation (the “Parent Company”), and any of its Subsidiaries that hereafter join this Agreement as Borrowers (with the Parent Company, each a “Borrower” and collectively, the “Borrowers”), each of the GUARANTORS (as hereinafter defined) party hereto, and HSBC BANK USA, NATIONAL ASSOCIATION (“HSBC” or “Lender”).
AMENDED AND RESTATED CREDIT AGREEMENTCredit Agreement • May 16th, 2014 • Park Electrochemical Corp • Printed circuit boards
Contract Type FiledMay 16th, 2014 Company IndustryTHIS AMENDED AND RESTATED CREDIT AGREEMENT (as hereafter amended, modified, supplemented or restated, this “Agreement”) is dated as of February 12, 2014 and is made by and among PARK ELECTROCHEMICAL CORP., a New York corporation (the “Parent Company”), and any of its Subsidiaries that hereafter join this Agreement as Borrowers (with the Parent Company, each a “Borrower” and collectively, the “Borrowers”), each of the GUARANTORS (as hereinafter defined) party hereto, and PNC BANK, NATIONAL ASSOCIATION (the “Lender”).
54,000,000 REVOLVING CREDIT FACILITY CREDIT AGREEMENT by and among PARK ELECTROCHEMICAL CORP., as Borrower, THE GUARANTORS PARTY HERETO, and PNC BANK, NATIONAL ASSOCIATION, as Lender Dated: as of January 30, 2013Credit Agreement • May 16th, 2013 • Park Electrochemical Corp • Printed circuit boards
Contract Type FiledMay 16th, 2013 Company Industry