Exhibit 10.35.1
Patent, Information and Trademark Agreement - Amendment No. 1
The agreement dated February 9, 1998 by and between Compositech Ltd. and
Compositech Taiwan or Compositech Technologies Inc. is hereby amended effective
February 9, 1998 as follows:
Article 1.2 Licensed Products and Article 1.3 Licensor's Patents are deleted and
replaced by the following:
1.2 Licensed Products. "Licensed Products" shall mean copper clad laminates for
use as printed circuit boards, in which the filaments in the layers are parallel
rather than woven, but excluding all such laminates within the scope of any
claims of Licensor's Patents relating to (i) multilayer printed circuit boards,
as defined in claims 86-95 or made by the method defined in claims 96-104 of
Licensor's R.O.C. patent 34,906, and (ii) integral circuits, as defined in
claims 19 and 35 or made according to the method or with the apparatus defined
in claims 16, 33, 34, 36, 37, 43, 44, 53, 54 or 72 of Licensor's R.O.C. patent
34,906, provided that the metal or conductive surface is in the form of a
circuit and further provided that the circuit is formed on the tooling and
transferred to the laminate or printed circuit board during the molding process.
1.3 Licensor's Patents. "Licensor's Patents" shall mean all patents and/or
applications in the Territory owned or controlled by Licensor or under which
Licensor has the right to grant licenses at any time during the term of this
Agreement and relating to the field of Licensed Products, and any and all
reissues, extensions, patents of addition and patents for improvements thereon,
including Licensor's R.O.C. Patent No. 34906 but excluding claims or parts of
claims relating to (i) multilayer printed circuit boards, as defined in claims
86-95 or made by the method defined in claims 96-104 of Licensor's R.O.C. patent
34,906, and (ii) integral circuits, as defined in claims 19 and 35 or made
according to the method or with the apparatus defined in claims 16, 33, 34, 36,
37, 43, 44, 53, 54 or 72 of Licensor's R.O.C. patent 34,906, provided that the
metal or conductive surface is in the form of a circuit and further provided
that the circuit is formed on the tooling and transferred to the laminate or
printed circuit board during the molding process.
COMPOSITECH LTD.
BY:____________________________
Name: Xxxx X. Xxxxxx
Title: President
COMPOSITECH TAIWAN (or
Compositech Technologies,
Inc.)
BY: ___________________________
Name:
Title:
1
