Micron Technology Inc Sample Contracts

RECITALS
Voting Agreement • April 4th, 2001 • Micron Technology Inc • Semiconductors & related devices • Delaware
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EXHIBIT 2 AGREEMENT AND PLAN OF MERGER
Agreement and Plan of Merger • April 4th, 2001 • Micron Technology Inc • Semiconductors & related devices • Delaware
AGREEMENT ---------
Stock Option Agreement • June 20th, 1997 • Micron Technology Inc • Semiconductors & related devices • Delaware
EXHIBIT 10.135 SECOND AMENDED AND RESTATED REVOLVING CREDIT AGREEMENT Dated as of September 1, 1998
Security Agreement • November 2nd, 1998 • Micron Technology Inc • Semiconductors & related devices • California
and Norwest Bank Minnesota, National Association Trustee
Micron Technology Inc • October 16th, 1998 • Semiconductors & related devices
ARTICLE 1. GRANT OF WARRANT AND EXERCISE PRICE
Micron Technology Inc • May 28th, 1999 • Semiconductors & related devices • Delaware
EXHIBIT 10.116 MICRON TECHNOLOGY, INC. REGISTRATION RIGHTS AGREEMENT Dated as of June 28, 1996 TABLE OF CONTENTS -----------------
Registration Rights Agreement • October 4th, 1996 • Micron Technology Inc • Semiconductors & related devices • Idaho
VOTING AGREEMENT
Voting Agreement • July 29th, 1998 • Micron Technology Inc • Semiconductors & related devices • California
TO
Micron Technology Inc • June 3rd, 1997 • Semiconductors & related devices • New York
EXHIBIT 1 ACQUISITION AGREEMENT*
Acquisition Agreement • May 28th, 1999 • Micron Technology Inc • Semiconductors & related devices • Delaware
and Norwest Bank Minnesota, National Association Trustee
Micron Technology Inc • July 3rd, 1997 • Semiconductors & related devices
CREDIT AGREEMENT among MICRON TECHNOLOGY, INC., as Borrower and THE LENDERS PARTY HERETO, and JPMORGAN CHASE BANK, N.A., as Administrative Agent and as Collateral Agent Dated as of July 3, 2018 JPMORGAN CHASE BANK, N.A. and HSBC SECURITIES (USA) INC....
Credit Agreement • October 15th, 2018 • Micron Technology Inc • Semiconductors & related devices • New York

THIS CREDIT AGREEMENT, dated as of July 3, 2018, among MICRON TECHNOLOGY, INC., a Delaware corporation (the “Borrower”), JPMORGAN CHASE BANK, N.A. (“JPMorgan”), as administrative agent (in such capacity and including any successors in such capacity, the “Administrative Agent” or the “Agent”) and as collateral agent (in such capacity and including any successors in such capacity, the “Collateral Agent”), the other agents party hereto and each of the financial institutions from time to time party hereto (collectively, the “Lenders”).

TO
Micron Technology Inc • June 3rd, 1997 • Semiconductors & related devices • New York
EXHIBIT 1.2 PRICING AGREEMENT
Pricing Agreement • July 3rd, 1997 • Micron Technology Inc • Semiconductors & related devices
Contract
Credit Agreement • December 8th, 2014 • Micron Technology Inc • Semiconductors & related devices • New York
MICRON TECHNOLOGY, INC. 1.625% CONVERTIBLE SENIOR NOTES DUE 2033 2.125% CONVERTIBLE SENIOR NOTES DUE 2033 PURCHASE AGREEMENT
Purchase Agreement • February 12th, 2013 • Micron Technology Inc • Semiconductors & related devices • New York

The undersigned understands that Morgan Stanley & Co. LLC (“Morgan Stanley”) proposes to enter into a Purchase Agreement (the “Purchase Agreement”) with Micron Technology, Inc., a Delaware corporation (the “Company”), providing for the offering (the “Offering”) by the several initial purchasers, including Morgan Stanley (the “Initial Purchasers”), of up to approximately $600,000,000 aggregate principal amount of Convertible Senior Notes (the “Securities”). The Securities will be convertible into shares of common stock, par value $0.10 per share, of the Company (the “Common Stock”).

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INDENTURE Dated as of April 30, 2015 Between MICRON TECHNOLOGY, INC. and U.S. BANK NATIONAL ASSOCIATION, as Trustee 5.250% SENIOR NOTES DUE 2024
Indenture • April 30th, 2015 • Micron Technology Inc • Semiconductors & related devices • New York

INDENTURE, dated as of April 30, 2015 between Micron Technology, Inc., a Delaware corporation, and U.S. Bank National Association, a national banking association, as Trustee.

TO
Micron Technology Inc • July 3rd, 1997 • Semiconductors & related devices • New York
AMENDMENT NO. 2 TO TERM LOAN CREDIT AGREEMENT
Term Loan Credit Agreement • June 29th, 2023 • Micron Technology Inc • Semiconductors & related devices • New York

AMENDMENT NO. 2 TO TERM LOAN CREDIT AGREEMENT, dated as of June 7, 2023 (this “Amendment”) by Wells Fargo Bank, National Association, as administrative agent under the Existing Term Loan Credit Agreement (as defined below) (in such capacity and including any successors in such capacity, the “Administrative Agent”).

AGREEMENT AND PLAN OF MERGER BY AND AMONG MICRON TECHNOLOGY, INC. MARCH 2006 MERGER CORP. AND LEXAR MEDIA, INC.
Agreement and Plan of Merger • March 10th, 2006 • Micron Technology Inc • Semiconductors & related devices • Delaware

This AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of March 8, 2006, by and among Micron Technology, Inc., a Delaware corporation (“Parent”), March 2006 Merger Corp., a Delaware corporation and direct wholly owned subsidiary of Parent (“Merger Sub”), and Lexar Media, Inc., a Delaware corporation (the “Company”).

MICRON TECHNOLOGY, INC. as Issuer and U.S. BANK NATIONAL ASSOCIATION as Trustee
Indenture • November 18th, 2013 • Micron Technology Inc • Semiconductors & related devices • New York

INDENTURE dated as of November 12, 2013 between Micron Technology, Inc., a Delaware corporation (the “Company”), and U.S. Bank National Association, a national banking association, as Trustee.

EXHIBIT 2 INVESTOR RIGHTS AGREEMENT
Investor Rights Agreement • May 28th, 1999 • Micron Technology Inc • Semiconductors & related devices • California
to
Micron Technology Inc • April 11th, 2000 • Semiconductors & related devices • New York
RECITALS
Registration Rights Agreement • April 4th, 2001 • Micron Technology Inc • Semiconductors & related devices • Delaware
AMENDMENT NO. 2 TO CREDIT AGREEMENT
Credit Agreement • June 29th, 2023 • Micron Technology Inc • Semiconductors & related devices • New York

AMENDMENT NO. 2 TO CREDIT AGREEMENT, dated as of June 7, 2023 (this “Amendment”) by HSBC Bank USA, National Association, as administrative agent under the Existing Credit Agreement (as defined below) (in such capacity and including any successors in such capacity, the “Administrative Agent”).

TECHNOLOGY TRANSFER AND LICENSE OPTION AGREEMENT
Technology Transfer and License Option Agreement • September 8th, 2016 • Micron Technology Inc • Semiconductors & related devices • Delaware

This TECHNOLOGY TRANSFER AND LICENSE OPTION AGREEMENT FOR 1Y PROCESS NODE (this “Agreement”), is made and entered into as of February 3, 2016, by and between Micron Technology, Inc., a Delaware corporation (“Micron”), and Nanya Technology Corporation (Nanya Technology Corporation [Translation from Chinese]), a company incorporated under the laws of the Republic of China (“NTC”). (Micron and NTC are referred to in this Agreement individually as a “Party” and collectively as the “Parties”).

REGISTRATION RIGHTS AGREEMENT Dated February 3, 2015 among MICRON TECHNOLOGY, INC. GOLDMAN, SACHS & CO. MORGAN STANLEY & CO. LLC and CREDIT SUISSE SECURITIES (USA) LLC
Registration Rights Agreement • February 3rd, 2015 • Micron Technology Inc • Semiconductors & related devices • New York

THIS REGISTRATION RIGHTS AGREEMENT (this “Agreement”) is made and entered into this 3rd day of February, 2015 among Micron Technology, Inc., a Delaware corporation, (the “Company”), the Guarantors from time to time party hereto (the “Guarantors”), Goldman, Sachs & Co., Morgan Stanley & Co. LLC and Credit Suisse Securities (USA) LLC as representatives (collectively, the “Representatives”) of the initial purchasers (collectively, the “Initial Purchasers”) named in Schedule I to the Purchase Agreement, dated January 29, 2015, among the Company and the Representatives (the “Purchase Agreement”).

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