Sales AgreementSales Agreement • July 6th, 2021 • SemiLEDs Corp • Semiconductors & related devices • New York
SemiLEDs Corporation, a Delaware corporation (the “Company”), confirms its agreement (this “Agreement”) with Roth Capital Partners, LLC (the “Agent”), as follows:
SEMILEDS CORPORATION (a Delaware corporation) · Shares of Common Stock UNDERWRITING AGREEMENTUnderwriting Agreement • October 6th, 2010 • SemiLEDs Corp • Semiconductors & related devices • New York
SEMILEDS CORPORATION INDEMNIFICATION AGREEMENTIndemnification Agreement • October 26th, 2010 • SemiLEDs Corp • Semiconductors & related devices • Delaware
This Indemnification Agreement (this “Agreement”) is made as of , by and between SemiLEDs Corporation, a Delaware corporation (the “Company”), and (“Indemnitee”).
SEMILEDS CORPORATION (a Delaware corporation) · Shares of Common Stock UNDERWRITING AGREEMENTUnderwriting Agreement • November 16th, 2010 • SemiLEDs Corp • Semiconductors & related devices • New York
Loan Agreement (Used for Short-term, Medium-term, and Long-term Loan)Loan Agreement • April 12th, 2011 • SemiLEDs Corp • Semiconductors & related devices
This Loan Agreement (the “Agreement”) is made and entered into by SemiLEDs Optoelectronics Co. Ltd., represented by Chairman Trung Doan (hereinafter the “Borrower”) and the guarantor who shall act as a joint and several guarantor for the Borrower (hereinafter the “Guarantor”, and the Guarantor and the Borrower hereinafter collectively the “Obligors”) for application of the loan facility from E. Sun Bank (hereinafter the “Bank”). In addition to comply with the Credit Facility Agreement, the Joint Guarantee Agreement and other agreements entered into with the Bank, The Obligors agree to comply with the terms and condition as follows:
AMENDED AND RESTATED EMPLOYMENT AGREEMENTEmployment Agreement • August 6th, 2010 • SemiLEDs Corp • California
This Amended and Restated Employment Agreement (this “Agreement”) is entered into as of March 15, 2005 by and between SEMILEDS CORPORATION, a Delaware corporation (the “Company”), and TRUNG TRI DOAN (“Executive”), and shall become effective as set forth below.
Medium- and Long-Term Credit Facility AgreementFacility Agreement • November 20th, 2019 • SemiLEDs Corp • Semiconductors & related devices
This Credit Facility Agreement (hereinafter referred to as the “Agreement”) is entered into by Mega International Commercial Bank Co., Ltd. (hereinafter referred to as Party A)
AMENDED AND RESTATED PATENT ASSIGNMENT AND LICENSE AGREEMENT BY AND BETWEEN SemiLEDs Corporation AND Xurui Guangdian Co., Ltd. ON July 19, 2010Patent Assignment and License Agreement • October 6th, 2010 • SemiLEDs Corp • Semiconductors & related devices
SemiLEDs Corporation, an American corporation incorporated and existing under the laws of USA, with registered office at 999 Main Street, Suite 1010, Boise, ID83702, USA and duly represented by Trung Tri Doan (nationality: USA) (hereinafter referred to as “Assignor”); and
LOAN AGREEMENTLoan Agreement • January 11th, 2019 • SemiLEDs Corp • Semiconductors & related devices
This Loan Agreement (as amended, restated, modified or otherwise supplemented from time to time, this “Agreement”) is entered into as of January 8, 2019 (the “Agreement Date”), by and between SemiLEDs Corporation, a corporation organized under the laws of the state of Delaware (the “Borrower”), and J. R. Simplot Company, a corporation organized under the laws of the state of Nevada (the “Lender”).
AMENDMENT TO CONVERTIBLE UNSECURED PROMISSORY NOTEConvertible Unsecured Promissory Note • November 29th, 2021 • SemiLEDs Corp • Semiconductors & related devices
This Amendment to Convertible Unsecured Promissory Note (this “Amendment”) is entered into as of May 26, 2021 (“Effective Date”) by and between SemiLEDs Corporation (“Borrower”) and Simplot Taiwan Inc. (“Lender”) (Borrower and Lender are hereinafter collectively referred to as “Parties”, and individually a “Party”)
WARRANTY AGREEMENTWarranty Agreement • September 14th, 2010 • SemiLEDs Corp • Semiconductors & related devices
This Warranty Agreement (the “Agreement”) is entered into effective as of March 13th , 2009 (the “Effective Date”) between Semi-Photonics Co., Ltd., a company with offices at 7F, No. 13 Ke Jung Rd., Chu-Nan Site, Hsinchu Science Park, Chu-Nan 350, Taiwan (“Company”), and LiteOn Technology Corporation , a company with business address at 12F, 392, Ruey Kuang Road, Neihu, Taipei,114, Taiwan, R.O.C. (“Customer”).
SEMI-PHOTONICS CO., LTD. INTERNATIONAL DISTRIBUTION AGREEMENTInternational Distribution Agreement • October 6th, 2010 • SemiLEDs Corp • Semiconductors & related devices • California
This International Distribution Agreement (the “Agreement”) is made and entered into effective December 20, 2006 (the “Effective Date”) between SEMI-PHOTONICS CO., LTD., a company with offices at 7F, No.13 Ke Jung Rd., Chu-Nan Site, Hsinchu Science Park, Chu- Nan 350, Taiwan (“Company”), and NANOTECO CORP., a Japanese company with offices at 408 Mitaka Sangyo Plaza, 3-38-4 Shimorenjaku, Mitaka, Tokyo, 181-8525 Japan (“Distributor”).
LEASE AGREEMENTLease Agreement • October 6th, 2010 • SemiLEDs Corp • Semiconductors & related devices
THIS LEASE AGREEMENT (this “Agreement”) is entered into as of this fist day of December, 2006 (“Effective Date”), by and between SEMI-PHOTONICS CO., LTD., a Taiwan company having offices at 7F, No.13, Ke Jung Rd., Chu-Nan Site, Hsinchu Science Park, Chu-Nan 350, Miao-Li County, Taiwan, the Republic of China (“R.O.C.”) (the “Lessee”), and LUXXON TECHNOLOGY CORPORATION, a Taiwan company having offices at 12-5, Dungshr, 2 Lin, Dungming Tsuen, Shinwu Shiang, 327, Taoyuan County, Taiwan, R.O.C. (the “ Lessor”). The Lessee and the Lessor are hereinafter referred to individually as a “Party” and collectively as the “Parties.”
COMMON STOCK PURCHASE AGREEMENTCommon Stock Purchase Agreement • January 17th, 2020 • SemiLEDs Corp • Semiconductors & related devices • Delaware
COMMON STOCK PURCHASE AGREEMENT (this “Agreement”), dated as of January [17], 2020, by and between SemiLEDs Corporation, a Delaware corporation (the “Company”), and XianChang Ma, an individual (the “Investor”), with China Passport # G44889945 and resides at Number 6, Lane 3, Central Street, Hulou Village, Gaohe Town, Jinxiang County, Shangdong Province, China.
SEMI-PHOTONICS EMPLOYEE AGREEMENTEmployee Agreement • September 14th, 2010 • SemiLEDs Corp • Semiconductors & related devices
This Employee Agreement (the “Agreement”) is entered into by and between Lanfang (Lydia) Chin (“Employee”) and Semi-Photonics Co., Ltd., a company organized under the laws of Republic of China (the “Company”), dated effective as of November 17, 2008.
ASSIGNMENT AND ASSUMPTION OF PURCHASE AGREEMENTAssignment and Assumption of Purchase Agreement • August 23rd, 2016 • SemiLEDs Corp • Semiconductors & related devices • Delaware
THIS ASSIGNMENT AND ASSUMPTION OF PURCHASE AGREEMENT (this “Assignment”) is made as of August 4, 2016, between PETER CHIOU, an individual (the “Assignor”), and WELL THRIVE LIMITED, a Samoa international company (the “Assignee”).
FOURTH AMENDMENT TO LOAN AGREEMENTLoan Agreement • January 9th, 2024 • SemiLEDs Corp • Semiconductors & related devices
This Fourth Amendment to Loan Agreement (“Fourth Amendment”) is entered into as of January 7, 2024 (“Effective Date”) by and between SemiLEDs Corporation (“Borrower”), and Trung Doan (“Lender”) (the Borrower and the Lender are hereinafter collectively referred to as “Parties”, and individually a “Party”).
COMPREHENSIVE LOAN AGREEMENTComprehensive Loan Agreement • July 12th, 2011 • SemiLEDs Corp • Semiconductors & related devices
This Comprehensive Loan Agreement (the “Agreement”) is made and entered into by SemiLEDs Optoelectronics Co. Ltd., represented by Chairman Trung Doan (hereinafter the “Borrower”) and the guarantor who shall act as a joint and several guarantor for the Borrower (hereinafter the “Guarantor”), and the Guarantor and the Borrower (hereinafter collectively the “Obligors”) for application of the loan facility from E. SUN Commercial Bank (hereinafter the “Bank”). In addition to complying with the Credit Facility Agreement, the Joint Guarantee Agreement and other agreements entered into with the Bank, the Obligors agree to comply with the terms and condition as follows:
Assignment of LOAN AGREEMENTAssignment of Loan Agreement • January 9th, 2024 • SemiLEDs Corp • Semiconductors & related devices
For Value Received, J. R. Simplot Company, a Nevada corporation (“Assignor”), hereby assigns and transfers all of the Assignor’s right, title and interest in and to the Loan Agreement and all Loan Documents as defined in the Loan Agreement (the “Loan”) by and between SemiLEDs Corporation, a Delaware corporation, as borrower, and Assignor, as lender, dated January 8, 2019, in the original principal amount of $1,500,000 to Simplot Taiwan Inc., an Idaho corporation (“Assignee”), in accordance with and subject to the terms and conditions of the Loan.
AMENDMENT NO. 1 TO PURCHASE AGREEMENTPurchase Agreement • August 23rd, 2016 • SemiLEDs Corp • Semiconductors & related devices • Delaware
This Amendment No. 1 to Purchase Agreement (this “Amendment”) is hereby entered into, as of August 23, 2016, by and among SemiLEDs Corporation, a Delaware corporation (the “Company”), PETER CHIOU, an individual (the “Assignor”), and WELL THRIVE LIMITED, a Samoa international company (the “Assignee” and together with the Assignor, the “Counterparties”).
THIRD AMENDMENT TO CONVERTIBLE UNSECURED PROMISSORY NOTEPromissory Note • June 6th, 2023 • SemiLEDs Corp • Semiconductors & related devices
This Third Amendment to Convertible Unsecured Promissory Note (this “Third Amendment”) is entered into as of June 6, 2023 (“Effective Date”) by and between SemiLEDs Corporation (“Borrower”) and Simplot Taiwan Inc. (“Lender”) (Borrower and Lender are hereinafter collectively referred to as “Parties”, and individually a “Party”)
FOURTH AMENDMENT TO LOAN AGREEMENTLoan Agreement • January 9th, 2024 • SemiLEDs Corp • Semiconductors & related devices
This Fourth Amendment to Loan Agreement (this “Fourth Amendment”) is entered into as of January 07, 2024 (“Effective Date”) by and between SemiLEDs Corporation (“Borrower”) and Simplot Taiwan Inc. (“Lender”) (Borrower and Lender are hereinafter collectively referred to as “Parties”, and individually a “Party”).
Agreement for Issuance of Overseas Letter of Credit(the “Agreement”)SemiLEDs Corp • October 6th, 2010 • Semiconductors & related devices
The contracting party: SemiLEDs Optoelectronics Co., Ltd., represented by the Chairman, Trung Doan (hereinafter referred to as the “Appointer”).In order to proceed settlement of exchange at E.Sun Bank (hereinafter referred to as the “Bank”) for purchasing the goods and materials from foreign countries, the Appointer invites the guarantor bearing the joint and several liabilities hereunder (hereinafter referred to as the “Guarantor”, together with the Appointer as the contracting parties) to execute the Agreement. Based on the percentage of the letter of credit (hereinafter referred to as “L/C”) approved by the Bank and in accordance with the agreed deposits, the Appointer commissions the Bank to issue overseas L/C on a oone-timeo partial xcycle basis and to advance payment in foreign currency (hereinafter referred to as “advance payment”) or accept or apply for delivery for an import collection under the guarantee delivery / bill of lading endorsed or borrowing etc., up to the amount o
EMPLOYMENT AGREEMENTEmployment Agreement • September 14th, 2010 • SemiLEDs Corp • Semiconductors & related devices
SEMI-PHOTONICS CO., LTD. PROPRIETARY INFORMATION AND INVENTIONS AGREEMENTProprietary Information and Inventions Agreement • September 14th, 2010 • SemiLEDs Corp • Semiconductors & related devices
This Proprietary Information and Inventions Agreement (this “Agreement”) is entered into between me, , and Semi-Photonics Co., Ltd., a company organized under the laws of Republic of China (Taiwan), and its affiliates (collectively, the “Company”). In consideration for the compensation received by me for employment with the Company, and effective as of the date that my employment commences, I agree as follows:
SEMILEDS CORPORATION AMENDED AND RESTATED INVESTOR RIGHTS AGREEMENTInvestor Rights Agreement • August 6th, 2010 • SemiLEDs Corp • California
This Amended and Restated Investor Rights Agreement (this “Agreement”) is made and entered into as of April 1, 2010, by and among SemiLEDs Corporation, a Delaware corporation (the “Company”), the persons listed on Exhibit A attached hereto (the “Stockholders”), and the persons listed on Exhibits B and C attached hereto or as may be added in the future as signatories to this Agreement in connection with purchases of Series E Preferred Stock of the Company (collectively, the “Investors”).
COMMON STOCK PURCHASE AGREEMENTCommon Stock Purchase Agreement • December 23rd, 2014 • SemiLEDs Corp • Semiconductors & related devices • Delaware
COMMON STOCK PURCHASE AGREEMENT (this “Agreement”), dated as of December 15, 2014, by and between SemiLEDs Corporation, a Delaware corporation (the “Company”), and Xiaoqing Han, an individual (the “Investor”).
SEMILEDS PHOTONICS EMPLOYEE AGREEMENTEmployee Agreement • August 6th, 2010 • SemiLEDs Corp
This Employee Agreement (the “Agreement”) is entered into by and between Jack Yeh (“Employee”) and Semi-Photonics Co., Ltd., a company organized under the laws of Republic of China (the “Company”), dated effective as of August 2, 2005.
Xurui Guangdian Co., Ltd. Capital Increase Agreement March 26, 2010SemiLEDs Corp • September 14th, 2010 • Semiconductors & related devices
WHEREAS: Xurui Guangdian Co., Ltd. (hereinafter referred to as the “Company”) convened an extraordinary general meeting on [Month] [date], 2010 and adopted a resolution to issue 92,170,000 ordinary shares (hereinafter referred to as the “Increased Shares”), with par value per share of RMB 1 and the issue price of RMB 2.11 (the part of the issue price exceeding the par value will be put into the capital reserve of the Company), thus increasing the registered capital of the Company to RMB 204,830,000 from RMB 112,660,000.
FIFTH AMENDMENT TO LOAN AGREEMENTLoan Agreement • February 20th, 2024 • SemiLEDs Corp • Semiconductors & related devices
This Fifth Amendment to Loan Agreement (this “Fifth Amendment”) is entered into as of February 9, 2024 (“Effective Date”) by and between SemiLEDs Corporation (“Borrower”), and Trung Doan (“Lender”) (the Borrower and the Lender are hereinafter collectively referred to as “Parties”, and individually a “Party”).
EMPLOYMENT AGREEMENTEmployment Agreement • August 6th, 2010 • SemiLEDs Corp
This Employment Agreement (this “Agreement”) is entered into effective as of August 14, 2007 (the “Effective Date”) by and between SEMILEDS CORPORATION, a Delaware corporation (the “Company”), and DAVID YOUNG (“Employee”). The term Company in this Agreement (other than the application of Section 2) shall include its affiliates where appropriate.
AMENDMENT TO CONVERTIBLE UNSECURED PROMISSORY NOTEConvertible Unsecured Promissory Note • November 29th, 2021 • SemiLEDs Corp • Semiconductors & related devices
This Amendment to Convertible Unsecured Promissory Note (this “Amendment”) is entered into as of May 26, 2021 (“Effective Date”) by and between SemiLEDs Corporation (“Borrower”) and Trung Doan (“Lender”) (Borrower and Lender are hereinafter collectively referred to as “Parties”, and individually a “Party”)
THIRD AMENDMENT TO CONVERTIBLE UNSECURED PROMISSORY NOTEConvertible Unsecured Promissory Note • June 6th, 2023 • SemiLEDs Corp • Semiconductors & related devices
This Third Amendment to Convertible Unsecured Promissory Note (this “Third Amendment”) is entered into as of June 6, 2023 (“Effective Date”) by and between SemiLEDs Corporation (“Borrower”) and Trung Tri Doan (“Lender”) (Borrower and Lender are hereinafter collectively referred to as “Parties”, and individually a “Party”)
SEMI-PHOTONICS EMPLOYEE AGREEMENTEmployee Agreement • September 14th, 2010 • SemiLEDs Corp • Semiconductors & related devices
This Employee Agreement (the “Agreement”) is entered into by and between Jack Yeh (“Employee”) and Semi-Photonics Co., Ltd., a company organized under the laws of Republic of China (the “Company”), dated effective as of August 2, 2005.
COLLABORATION AND DISTRIBUTION AGREEMENTCollaboration and Distribution Agreement • October 26th, 2010 • SemiLEDs Corp • Semiconductors & related devices • California
This Collaboration and Distribution Agreement (the “Agreement”) is entered into effective as of April 18, 2007 (the “Effective Date”) by and between INTEMATIX CORPORATION, a California corporation and its Affiliates (“Intematix”), and SEMILEDS CORPORATION, a Delaware corporation and its Affiliates (“SemiLEDs”).
