Common use of Term Defined In Clause in Contracts

Term Defined In. Acquiring Party Section 8.1(d) Alternative Use Section 6.5(c)(i) Amendment No. 4 to Patent Cross License Agreement Section 2.1(c)(iii) Appointing Party Section 6.9(b)(i) [***] Section 6.5(c)(ii)(B) Closing Section 2.1(a) Committee Representatives Section 6.9(b)(i) Common R&D Agreement Section 2.1(c)(i) Common R&D Development Expenses Section 6.8(a)(i) Costs Section 6.5(c)(i) Cross License Agreement Section 2.1(c)(iii) Defaulting Party Section 6.12(d) EC Party/Excess Capacity Party Section 6.7(b)(i) Embedded NAND Product Section 6.7(c)(ii) Employer Section 6.10(b)(vii) Engineers Section 6.10 Environmental Indemnification Agreement Section 2.1(b)(vii) Equipment Section 6.5(c)(i) Evaluation Wafers Section 6.8(a)(iii) Financing Section 6.12(b)(iii) Flash Alliance Section 2.1(b) FA Foundry Agreement Section 2.1(b)(iv) FA Operating Agreement Section 2.1(b)(ii) FA Operative Documents Section 2.1(b) FA Patent Indemnification Agreement Section 2.1(b)(vi) FA Termination Date Section 8.1(b) FA Shares Section 4.2(a) FP Master Agreement Recitals FP NAND Flash Memory Products Section 3.3(a) FVC Japan Master Agreement Recitals FVC Japan NAND Flash Memory Products Section 3.3(a) Headcount Plan Section 6.10 ICs Section 3.2 Intellectual Property Section 4.7 Investing Party Section 6.5(c)(i) Joint Operative Documents Section 2.1(c) Lease Agreement Section 2.1(b)(viii) Management Committee Section 6.9 Minimum RUP Commitment Section 6.5(c)(i) Master Operative Documents Section 2.2

Term Defined In. 3D Collaboration Agreement Section 2.1(c)(v) 3D Memory Section 3.2(b)(i) 3D Memory Products Section 3.2(b)(ii) Acquiring Party Section 8.1(d9.1(d) Adjustment Payment Section 7.3 Agreement Section 1.1(b) Alternative Use Section 6.5(c)(i6.3(a)(iii) AMC Section 6.8(a)(i) ___________________ Amendment No. 4 5 to Patent Cross License Agreement Section 2.1(c)(iii) Appointing Party Building Depreciation Prepayment Section 6.9(b)(i8.2(a)(iii)(A) [***] Business Plan Section 6.5(c)(ii)(B5.1(a) Capital Interests Purchase Agreement Section 2.1(b)(i) Catch-Up Space Section 6.7(a)(iv) Closing Section 2.1(a) Committee Representatives Section 6.9(b)(i) Common R&D Agreement Section 2.1(c)(i) Common R&D Development Expenses Section 6.8(a)(i) Costs Section 6.5(c)(i6.3(a)(iii) Cross License Agreement Section 2.1(c)(iii) Defaulting Party Section 6.12(d) Designated Individuals Section 6.3(b)(ii) EC Party/Compensation Section 6.6(b)(i)(D) EC Party or Excess Capacity Party Section 6.7(b)(i6.6(b)(i) Embedded NAND Product Section 6.7(c)(ii6.6(c) Employer Section 6.10(b)(vii) Engineers Section 6.10 6.10(a)(ii) Environmental Indemnification Agreement Section 2.1(b)(vii) Equipment Section 6.5(c)(i6.3(a)(iii) Equivalent Lot Section 7.4(e) Evaluation Wafers Section 6.8(a)(iii) Financing Section 6.12(b)(iii) Flash Alliance Section 2.1(b6.8(a)(iv) FA Master Agreement Recitals FF Foundry Agreement Section 2.1(b)(iv) FA FF Headcount Plan Section 6.10(a)(i) FF Interests Section 4.2(a) FF Operating Agreement Section 2.1(b)(ii) FA FF Operative Documents Section 2.1(b) FA FF Patent Indemnification Agreement Section 2.1(b)(vi) FA FF Purchase and Supply Agreements Section 2.1(b)(v) FF Termination Date Section 8.1(b9.1(b) FA Shares Financing Section 4.2(a6.12(b)(iii) Fixed Manufacturing Costs Section 7.4(a)(i) Flash Forward Section 2.1(b) FP Master Agreement Recitals FP NAND Flash Memory Products Headcount Working Group Section 3.3(a6.10(a)(iii) FVC Japan Master Agreement Recitals FVC Japan NAND Flash Memory Products Section 3.3(a) Headcount Plan Section 6.10 ICs Section 3.2 3.2(a)(i) Intellectual Property Section 4.7 Investing Party Section 6.5(c)(i6.3(a)(ii) Investment Plan Section 6.3(b)(i) [***] Section 2.1(c)(iv) JMDY Development Expenses Section 6.8(a)(iv) Joint Operative Documents Section 2.1(c) Joint Tool Procurement Team Section 6.1(a) [***] Section 3.3(a)(i) [***] Section 3.3(a)(ii) JV Space Section 3.3(a) JV Y5 NAND Flash Memory Products Section 3.2(a)(ii) JV Y5 Wafer Sales Price Section 8.4(c)(i) JVRA Section 2.1(c)(vi) Leading Party Section 6.7(a) Lease Agreement Section 2.1(b)(viii) Management Committee Representative Section 6.9 Minimum RUP Commitment Section 6.5(c)(i) Master Operative Documents Section 2.22.2 NAND Section 3.2(a)(i)

Term Defined In. Collaboration Agreement Section ‎2.1(c)(v) 3D Memory Section ‎3.2(b)(i) 3D Memory Products Section ‎3.2(b)(ii) Acquiring Party Section 8.1(d‎9.1(d) Adjustment Payment Section ‎7.3 Agreement Section ‎1.1(b) Alternative Use Section 6.5(c)(i‎6.3(a)(iii) AMC Section ‎6.8(a)(i) Amendment No. 4 5 to Patent Cross License Agreement Section 2.1(c)(iii‎2.1(c)(iii) Appointing Party Building Depreciation Prepayment Section 6.9(b)(i‎8.2(a)(iii)(A) [Business Plan Section ‎5.1(a) Capital Interests Purchase Agreement Section ‎2.1(b)(i) Catch-Up Space Section ‎6.7(a)(iv) Closing Section ‎2.1(a) ***] Section 6.5(c)(ii)(B) Closing Section 2.1(a) Committee Representatives Section 6.9(b)(i) * Indicates that certain information contained herein has been omitted and filed separately with the Securities and Exchange Commission. Confidential treatment has been requested with respect to the omitted portions. Common R&D Agreement Section 2.1(c)(i‎2.1(c)(i) Common R&D Development Expenses Section 6.8(a)(i‎6.8(a)(i) Costs Section 6.5(c)(i‎6.3(a)(iii) Cross License Agreement Section 2.1(c)(iii‎2.1(c)(iii) Defaulting Party Section 6.12(d‎6.12(d) Designated Individuals Section ‎6.3(b)(ii) EC Party/Compensation Section ‎6.6(b)(i)(D) EC Party or Excess Capacity Party Section 6.7(b)(i‎6.6(b)(i) Embedded NAND Product Section 6.7(c)(ii‎6.6(c) Employer Section 6.10(b)(vii‎6.10(b)(vii) Engineers Section 6.10 ‎6.10(a)(ii) Environmental Indemnification Agreement Section 2.1(b)(vii‎2.1(b)(vii) Equipment Section 6.5(c)(i‎6.3(a)(iii) Equivalent Lot Section ‎7.4(e) Evaluation Wafers Section 6.8(a)(iii) Financing Section 6.12(b)(iii) Flash Alliance Section 2.1(b‎6.8(a)(iv) FA Master Agreement Recitals FF Foundry Agreement Section 2.1(b)(iv‎2.1(b)(iv) FA FF Headcount Plan Section ‎6.10(a)(i) FF Interests Section ‎4.2(a) FF Operating Agreement Section 2.1(b)(ii‎2.1(b)(ii) FA FF Operative Documents Section 2.1(b‎2.1(b) FA FF Patent Indemnification Agreement Section 2.1(b)(vi‎2.1(b)(vi) FA FF Purchase and Supply Agreements Section ‎2.1(b)(v) FF Termination Date Section 8.1(b‎9.1(b) FA Shares Financing Section 4.2(a‎6.12(b)(iii) Fixed Manufacturing Costs Section ‎7.4(a)(i) Flash Forward Section ‎2.1(b) FP Master Agreement Recitals FP Headcount Working Group Section ‎6.10(a)(iii) ICs Section ‎3.2(a)(i) Intellectual Property Section ‎4.7 Investing Party Section ‎6.3(a)(ii) Investment Plan Section ‎6.3(b)(i) **** Section ‎2.1(c)(iv) JMDY Development Expenses Section ‎6.8(a)(iv) Joint Operative Documents Section ‎2.1(c) Joint Tool Procurement Team Section ‎6.1(a) **** Section 3.3(a)(i) **** Section 3.3(a)(ii) JV Space Section ‎3.3(a) JV Y5 NAND Flash Memory Products Section 3.3(a‎3.2(a)(ii) FVC Japan Master Agreement Recitals FVC Japan NAND Flash Memory Products JV Y5 Wafer Sales Price Section 3.3(a8.4(c)(i) Headcount Plan JVRA Section 6.10 ICs Section 3.2 Intellectual Property Section 4.7 Investing ‎2.1(c)(vi) Leading Party Section 6.5(c)(i) Joint Operative Documents Section 2.1(c‎6.7(a) Lease Agreement Section 2.1(b)(viii‎2.1(b)(viii) Management Committee Representative Section 6.9 Minimum RUP Commitment Section 6.5(c)(i) ‎6.9 Master Operative Documents Section 2.2‎2.2 NAND Section ‎3.2(a)(i) NAND Flash Memory Integrated Circuits Section ‎6.13

Term Defined In. Collaboration Agreement Section ‎2.1(c)(v) 3D Memory Section ‎3.2(b)(i) 3D Memory Products Section ‎3.2(b)(ii) Acquiring Party Section 8.1(d‎9.1(d) Adjustment Payment Section ‎7.3 Agreement Section ‎1.1(b) Alternative Use Section 6.5(c)(i‎6.3(a)(iii) AMC Section ‎6.8(a)(i) Amendment No. 4 5 to Patent Cross License Agreement Section 2.1(c)(iii‎2.1(c)(iii) Appointing Party Building Depreciation Prepayment Section 6.9(b)(i‎8.2(a)(iii)(A) [Business Plan Section ‎5.1(a) Capital Interests Purchase Agreement Section ‎2.1(b)(i) Catch-Up Space Section ‎6.7(a)(iii) Closing Section ‎2.1(a) ***] Section 6.5(c)(ii)(B) Closing Section 2.1(a) Committee Representatives Section 6.9(b)(i) * Indicates that certain information contained herein has been omitted and filed separately with the Securities and Exchange Commission. Confidential treatment has been requested with respect to the omitted portions. Common R&D Agreement Section 2.1(c)(i‎2.1(c)(i) Common R&D Development Expenses Section 6.8(a)(i‎6.8(a)(i) Costs Section 6.5(c)(i‎6.3(a)(iii) Cross License Agreement Section 2.1(c)(iii‎2.1(c)(iii) Defaulting Party Section 6.12(d‎6.12(d) Designated Individuals Section ‎6.3(b)(ii) EC Party/Compensation Section ‎6.6(b)(i)(D) EC Party or Excess Capacity Party Section 6.7(b)(i‎6.6(b)(i) Embedded NAND Product Section 6.7(c)(ii‎6.6(c) Employer Section 6.10(b)(vii‎6.10(b)(viii) Engineers Section 6.10 ‎6.10(a)(ii) Environmental Indemnification Agreement Section 2.1(b)(vii‎2.1(b)(vii) Equipment Section 6.5(c)(i‎6.3(a)(iii) Equivalent Lot Section ‎7.4(e) Evaluation Wafers Section 6.8(a)(iii) Financing Section 6.12(b)(iii) Flash Alliance Section 2.1(b‎6.8(a)(iv) FA Master Agreement Recitals FF Foundry Agreement Section 2.1(b)(iv‎2.1(b)(iv) FA FF Headcount Plan Section ‎6.10(a)(i) FF Interests Section ‎4.2(a) FF Operating Agreement Section 2.1(b)(ii‎2.1(b)(ii) FA FF Operative Documents Section 2.1(b‎2.1(b) FA FF Patent Indemnification Agreement Section 2.1(b)(vi‎2.1(b)(vi) FA FF Purchase and Supply Agreements Section ‎2.1(b)(v) FF Termination Date Section 8.1(b‎9.1(b) FA Shares Financing Section 4.2(a‎6.12(b)(iii) Fixed Manufacturing Costs Section ‎7.4(a)(i) Flash Forward Section ‎2.1(b) FP Master Agreement Recitals FP Headcount Working Group Section ‎6.10(a)(iii) ICs Section ‎3.2(a)(i) Intellectual Property Section ‎4.7 Investing Party Section ‎6.3(a)(ii) Investment Plan Section ‎6.3(b)(i) **** Section ‎2.1(c)(iv) JMDY Development Expenses Section ‎6.8(a)(iv) Joint Operative Documents Section ‎2.1(c) Joint Tool Procurement Team Section ‎6.1(a) **** Section 6.1(a) **** Section 3.3(a)(i) JV Space Section ‎3.3(a) JV Y5 NAND Flash Memory Products Section 3.3(a‎3.2(a)(ii) FVC Japan Master Agreement Recitals FVC Japan NAND Flash Memory Products JV Y5 Wafer Sales Price Section 3.3(a8.4(c)(i) Headcount Plan JVRA Section 6.10 ICs Section 3.2 Intellectual Property Section 4.7 Investing ‎2.1(c)(vi) Leading Party Section 6.5(c)(i) Joint Operative Documents Section 2.1(c‎6.7(a) Lease Agreement Section 2.1(b)(viii‎2.1(b)(viii) Management Committee Representative Section 6.9 Minimum RUP Commitment Section 6.5(c)(i) ‎6.9 Master Operative Documents Section 2.2‎2.2 NAND Section ‎3.2(a)(i) NAND Flash Memory Integrated Circuits Section ‎6.13