Process Phase-In. Company desires to have TSMC manufacture the Contract Wafers using certain process Technology employed in Company’s own wafer foundry facilities and that meets Company’s specifications at the Facilities. To this end, the Parties shall execute from time to time during the term individual Process Supplements for each Company Process (e.g., for a particular process node) to be implemented at the Facilities. In connection therewith, the Parties shall undertake the following technology transfer activities to phase in the implementation of such Company Process Technology.
Appears in 2 contracts
Sources: Master Semiconductor Foundry and Technology Transfer Agreement (Spansion Inc.), Master Semiconductor Foundry and Technology Transfer Agreement (Spansion Inc.)