Loan Facilities. 17 2.1 Investment Capital Loan Commitments............................................................17 2.2 Working Capital Loan Commitments...............................................................17 2.3 Permitted Uses of Loan Proceeds................................................................18
Appears in 2 contracts
Sources: Credit Agreement (Leap Wireless International Inc), Credit Agreement (Leap Wireless International Inc)
Loan Facilities. 17 2.1 Investment Capital Loan Commitments...................................................................................................17 2.2 Working Capital Loan Commitments.........................................................................................................17 2.3 Permitted Uses of Loan Proceeds...........................................................................................................18
Appears in 1 contract