Die pricing Sample Clauses
Die pricing. The die pricing is calculated from the Wafer Pricing, gross die per (GDPW), and Yield.
Die pricing. If at any time during this Agreement, SCI determines that the administrative time and costs associated with maintaining Die pricing is unduly burdensome, it will notify LSI and the Parties will negotiate a resolution in good faith.
Die pricing. During the term of the contract products may be supplied from Foundry under die pricing. The die price of each product shall be assessed individually and attached hereunder. Die pricing of device * shall be allowed on the following basis. * * Both parties agree to provide the required engineering support to improve wafer yield for die based products. APPENDIX B (Ref: Clause 3.1, 3.2)
Die pricing. The die pricing is calculated from the [****], [****] per [****] ([****]), and [****].
Die pricing. The price to be paid by Tripath for the purchase of Dice hereunder fabricated using a particular Process, until adjusted in accordance herewith, shall be: