Die Attach Enhancement Clause Samples

Die Attach Enhancement. Using the epoxy-based die attach material as a benchmark, development of die attach formulations will aim at: * Eliminating voiding in the die attach, * Increasing the adhesion strength between the molding compound and the die attach surface by 50% at 240 deg C, * Decreasing cure time by 50% at 160 deg C, * Reducing water uptake by 50% for improved leadframe adhesion and better anti-popcorning, and * Developing new cyanate ester-based materials with: AGREEMENT NUMBER: MDA972-95-3-0024 ATTACHMENT NO. 1, PAGE 3 **Hot strength superior to epoxies at 260 deg C by 50%, **Stress index lower by at least 25%, and **Unique stable moisture-resistant properties.