By HP Sample Clauses
By HP. HP agrees to indemnify and defend JetFax from any costs, damages, and reasonable attorneys' fees resulting from all claims by third parties arising from the use, manufacture, and distribution of HP Products by HP and its direct and indirect customers in [...***...], provided that JetFax gives HP prompt written notice of any such claim, tenders to HP the defense or settlement of any such claim at HP's expense, and cooperates with HP, at HP's expense, in defending or settling such claim. HP will have no liability to JetFax with respect to any claim as to which JetFax is liable to HP pursuant to Section 14.1 ("By JetFax") above.
By HP. HP and Merger Sub shall give prompt notice to Compaq of any representation or warranty made by it contained in this Agreement becoming untrue or inaccurate, or any failure of HP to comply with or satisfy in any material respect any covenant, condition or agreement to be complied with or satisfied by it under this Agreement, in each case, such that the conditions set forth in Section 6.2(a) or 6.2(b) would not be satisfied.
By HP. The parties hereby agree and confirm that, as between the parties, HP retains for itself all right, title and interest, including all intellectual property rights, in and to HP’s Licensed Patents, HP Restricted Technology and HP Unrestricted Technology (except for any licenses expressly granted in Sections II, III and IV respectively) and that no transfer or assignment of ownership rights is intended by the parties.
By HP. 2.2.1 HP hereby grants to each of the Company and CSM a ********* ************************************* right and license without right of sublicense under HP Licensed Technology to use the HP Technical Information, to import, make (but not have made), use, sell, or otherwise dispose of semiconductor wafers and integrated circuits.
2.2.2 No right or license is granted to the Company, CSM or their respective Affiliates to utilize or reverse engineer HP Technical Information to derive or design products or processes except as expressly provided for herein; however, the Company and CSM may modify or prepare derivative works of HP Technical Information solely for the purpose of integrated circuit yield, process compatibility enhancements, and incorporation into Company and CSM processes, respectively.
By HP