Wolfspeed, Inc. Sample Contracts

EXHIBIT 10.14 MERGER AGREEMENT DATED AS OF APRIL 10, 2000 BY AND AMONG CREE, INC., CRYSTAL ACQUISITION, INC. NITRES, INC.
Merger Agreement • August 10th, 2000 • Cree Inc • Semiconductors & related devices • North Carolina
RIGHTS AGREEMENT
Rights Agreement • May 30th, 2002 • Cree Inc • Semiconductors & related devices • North Carolina
UNDERWRITING AGREEMENT CREE, INC. 11,000,000 Shares of Common Stock Underwriting Agreement
Underwriting Agreement • September 11th, 2009 • Cree Inc • Semiconductors & related devices • New York

Cree, Inc., a North Carolina corporation (the “Company”), proposes to issue and sell to the several Underwriters listed in Schedule 1 hereto (the “Underwriters”), for whom you are acting as representative (the “Representative”), an aggregate of 11,000,000 shares of Common Stock, par value $ 0.00125 per share, of the Company (the “Underwritten Shares”) and, at the option of the Underwriters, up to an additional 1,650,000 shares of Common Stock of the Company (the “Option Shares”). The Underwritten Shares and the Option Shares are herein referred to as the “Shares”. The shares of Common Stock of the Company to be outstanding after giving effect to the sale of the Shares are referred to herein as the “Stock”. Each share of Stock, including the Shares, will have attached thereto a right (each a “Right” and collectively, the “Rights”) to purchase one one-thousandth ( 1/1000) of a share of the Company’s preferred stock (“Preferred Stock”) or to acquire additional equity interests in the Comp

SUPPLY AGREEMENT
Supply Agreement • November 14th, 1996 • Cree Research Inc /Nc/ • Services-commercial physical & biological research • North Carolina
WOLFSPEED, INC. AND U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, as Trustee INDENTURE Dated as of November 21, 2022 1.875% Convertible Senior Notes due 2029
Indenture • November 21st, 2022 • Wolfspeed, Inc. • Semiconductors & related devices • New York

INDENTURE dated as of November 21, 2022 between WOLFSPEED, INC., a North Carolina corporation, as issuer (the “Company,” as more fully set forth in Section 1.01) and U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, a national banking association, as trustee (the “Trustee,” as more fully set forth in Section 1.01).

UNDERWRITING AGREEMENT
Underwriting Agreement • January 6th, 2000 • Cree Inc • Semiconductors & related devices • New York
AMENDED AND RESTATED RIGHTS AGREEMENT between CREE, INC. and AMERICAN STOCK TRANSFER & TRUST COMPANY, LLC as Rights Agent Dated as of April 24, 2012
Rights Agreement • April 26th, 2012 • Cree Inc • Semiconductors & related devices • North Carolina

AMENDED AND RESTATED RIGHTS AGREEMENT, dated as of May 30, 2002, and amended and restated as of April 24, 2012 (this "Agreement"), between CREE, INC., a North Carolina corporation (the "Company"), and AMERICAN STOCK TRANSFER & TRUST COMPANY, LLC, a New York limited liability company (the "Rights Agent").

UNDERWRITING AGREEMENT
Underwriting Agreement • February 8th, 1999 • Cree Research Inc /Nc/ • Semiconductors & related devices • New York
FIFTH AMENDMENT TO CREDIT AGREEMENT
Credit Agreement • April 30th, 2020 • Cree, Inc. • Semiconductors & related devices • New York

THIS FIFTH AMENDMENT TO CREDIT AGREEMENT (this “Amendment”), dated as of March 27, 2020, is by and among CREE, INC., a North Carolina corporation (the “Borrower”), the Lenders (as defined below) party hereto and WELLS FARGO BANK, NATIONAL ASSOCIATION, as administrative agent on behalf of the Lenders under the Credit Agreement (as hereinafter defined) (in such capacity, the “Administrative Agent”). Capitalized terms used herein and not otherwise defined herein shall have the meanings ascribed thereto in the Credit Agreement.

LICENSE AND TECHNOLOGY TRANSFER AGREEMENT between CREE RESEARCH, INC. ("Licensor") and SHIN-ETSU HANDOTAI CO. LTD. ("Licensee")
License and Technology Transfer Agreement • January 28th, 1997 • Cree Research Inc /Nc/ • Services-commercial physical & biological research • North Carolina
CREE, INC. Up to $500,000,000 Aggregate Sales Price of Common Stock EQUITY DISTRIBUTION AGREEMENT
Equity Distribution Agreement • February 12th, 2021 • Cree, Inc. • Semiconductors & related devices • New York

Cree, Inc., a North Carolina corporation (the “Company”), confirms its agreement (this “Agreement”) with Wells Fargo Securities, LLC, BMO Capital Markets Corp., BofA Securities Inc., Canaccord Genuity LLC, Citigroup Global Markets Inc., Credit Suisse Securities (USA) LLC, Goldman Sachs & Co. LLC, Morgan Stanley & Co. LLC and Truist Securities, Inc. (each, a “Manager” and, collectively, the “Managers”), as follows:

MASTER PERFORMANCE UNIT AWARD AGREEMENT
Master Performance Unit Award Agreement • August 29th, 2014 • Cree Inc • Semiconductors & related devices • North Carolina

This Master Performance Unit Award Agreement (this “Master Agreement” or “Agreement”) is entered into between you (the “Participant” named below) and Cree, Inc., a corporation formed under the laws of the State of North Carolina (the “Company”).

WOLFSPEED, INC. Up to $200,000,000 Aggregate Sales Price of Common Stock EQUITY DISTRIBUTION AGREEMENT
Equity Distribution Agreement • December 9th, 2024 • Wolfspeed, Inc. • Semiconductors & related devices

Wolfspeed, Inc., a North Carolina corporation (the “Company”), confirms its agreement (this “Agreement”) with J.P. Morgan Securities LLC and Wells Fargo Securities, LLC (each, a “Manager” and, collectively, the “Managers”), as follows:

TRANSFORMATION AGREEMENT
Transformation Agreement • August 12th, 1999 • Cree Research Inc /Nc/ • Semiconductors & related devices

a company incorporated under the laws of the Federal Republic of Germany, whose registered office is at Wittelsbacherplatz 2, 80312 Munich

PROMISSORY NOTE (Purchase Price Note)
Promissory Note • April 29th, 2021 • Cree, Inc. • Semiconductors & related devices • New York

FOR VALUE RECEIVED, the undersigned, SMART Global Holdings, Inc., a Cayman Islands exempted company (the “Company”, or the “Parent”), hereby unconditionally promises to pay to Cree, Inc., a North Carolina corporation (“Cree” and together with any permitted successor, permitted registered assignee or permitted transferee of, or other permitted holder of, this promissory note (this “Note”), the “Holder”) One Hundred Twenty-Five Million Dollars ($125,000,000.00) (the “Loan”). The Company further hereby agrees to pay interest on the unpaid principal amount hereof from time to time outstanding at the rates and on the dates specified in Article II. This Note is the Purchase Price Note referred to in, and was executed and delivered in connection with, that certain Asset Purchase Agreement made and entered into as of October 18, 2020 (as amended, supplemented or otherwise modified from time to time in accordance with the terms thereof, the “Purchase Agreement”), among (i) Cree, as the Seller,

PERFORMANCE SHARE AWARD AGREEMENT
Performance Share Award Agreement • August 23rd, 2023 • Wolfspeed, Inc. • Semiconductors & related devices

Participant: Award Number: Plan: 2013 Long-Term Incentive Compensation PlanAward Type: Performance SharesGrant Date: Performance Period:

PERFORMANCE SHARE AWARD AGREEMENT
Performance Share Award Agreement • August 23rd, 2023 • Wolfspeed, Inc. • Semiconductors & related devices

Participant: Award Number: Plan: 2013 Long-Term Incentive Compensation PlanAward Type: Performance SharesGrant Date: Performance Period:

EXECUTIVE CHANGE IN CONTROL AGREEMENT
Executive Change in Control Agreement • August 22nd, 2008 • Cree Inc • Semiconductors & related devices • North Carolina

This Executive Change in Control Agreement (the “Agreement”) is entered into as of August 19, 2008 (the “Effective Date”) by and between Cree, Inc. (the “Company”) and Stephen D. Kelley (“Executive”).

WOLFSPEED, INC., as Issuer, and the Subsidiary Guarantors party hereto from time to time, Senior Secured Notes due 2030 INDENTURE Dated as of June 23, 2023 and U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, as Trustee and Collateral Agent
Indenture • June 26th, 2023 • Wolfspeed, Inc. • Semiconductors & related devices • New York

INDENTURE, dated as of June 23, 2023, by and among Wolfspeed, Inc., a North Carolina corporation (the “Issuer”), the Subsidiary Guarantors (as defined below) party hereto from time to time and U.S. Bank Trust Company, National Association, a national banking association, not in its individual capacity but solely as the trustee hereunder (the “Trustee”) and as the collateral agent hereunder.

From: [Dealer] Attention: [__________] Telephone No.: [__________] Email: [__________] To: Wolfspeed, Inc. Durham, North Carolina 27703
Call Option Transaction • February 3rd, 2022 • Wolfspeed, Inc. • Semiconductors & related devices • New York

The purpose of this communication (this “Confirmation”) is to set forth the terms and conditions of the call option transaction entered into on the Trade Date specified below (the “Transaction”) between [Dealer] (“Dealer”) and Wolfspeed, Inc. (“Counterparty”). This communication constitutes a “Confirmation” as referred to in the Agreement specified below.

NONQUALIFIED STOCK OPTIONAWARD AGREEMENT(for Non-Employee Directors) Participant: ______________________________________ Award Number: ______________________________________ Plan: 2004 Long-Term Incentive Compensation Plan Award Type: Nonqualified...
Nonqualified Stock Option Award Agreement • October 17th, 2012 • Cree Inc • Semiconductors & related devices • North Carolina

Cree, Inc. (the “Company”) has awarded you a nonqualified stock option (the “Option”) to purchase _____ shares (the “Shares”) of the common stock of the Company at a purchase price of ___ per share, effective ____________, the Grant Date of the award. The Option is subject to and governed by the Cree, Inc. 2004 Long-Term Incentive Compensation Plan (the “Plan”) and the terms of this Nonqualified Stock Option Award Agreement (the “Agreement”).

WOLFSPEED, INC. as Issuer THE SUBSIDIARY GUARANTORS PARTY HERETO FROM TIME TO TIME, as Subsidiary Guarantors and U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, as Trustee and Collateral Agent
Indenture • September 30th, 2025 • Wolfspeed, Inc. • Semiconductors & related devices • New York

INDENTURE, dated as of September 29, 2025, among Wolfspeed, Inc., a Delaware corporation (the “Issuer”), the Subsidiary Guarantors (as defined below) party hereto from time to time and U.S. Bank Trust Company, National Association, a national banking association, not in its individual capacity but solely as the trustee hereunder (the “Trustee”) and as the collateral agent (the “Collateral Agent”) hereunder.

FIRST SUPPLEMENTAL INDENTURE
Supplemental Indenture • March 26th, 2026 • Wolfspeed, Inc. • Semiconductors & related devices • New York

FIRST SUPPLEMENTAL INDENTURE (this “Supplemental Indenture”), dated as of March 26, 2026, among WOLFSPEED, INC., a Delaware corporation (the “Issuer”), the SUBSIDIARY GUARANTOR party hereto (the “Subsidiary Guarantor”) and U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, as trustee (in such capacity, the “Trustee”) and collateral agent (in such capacity, the “Collateral Agent”) under the Indenture referred to below.

AMENDMENT NO. 1 TO RIGHTS AGREEMENT
Rights Agreement • October 16th, 2006 • Cree Inc • Semiconductors & related devices • North Carolina

THIS AMENDMENT NO. 1 (this “Amendment”) is entered into and dated as of October 16, 2006, by and between Cree, Inc., a North Carolina corporation (the “Company”), and American Stock Transfer & Trust Company, as Rights Agent (the “Rights Agent”).

CREE, INC. CHANGE IN CONTROL AGREEMENT (for Chief Executive Officer)
Change in Control Agreement • December 20th, 2012 • Cree Inc • Semiconductors & related devices • North Carolina

Cree, Inc. (the “Company”) and Charles M. Swoboda (“Executive”) entered into an Employment Agreement effective as of October 13, 2004, which was subsequently amended and restated effective as of August 21, 2007, and superseded and replaced with an Executive Change in Control Agreement dated August 18, 2008 (the “Existing Agreement”). This Chief Executive Change in Control Agreement (the “Agreement”) between Company and Executive supersedes and replaces the Existing Agreement as of the 17th day of December, 2012 (the “Effective Date”). Upon full execution and delivery of this Agreement and the exchange of good and valuable consideration, the receipt and sufficiency of which is acknowledged, the parties hereby agree to terminate the Existing Agreement as of the Effective Date.

Certain confidential information contained in this exhibit has been omitted by means of redacting a portion of the text and replacing it with [***], pursuant to Regulation S-K Item 601(b) of the Securities Act of 1933, as amended. Certain confidential...
Asset Purchase Agreement • August 28th, 2023 • Wolfspeed, Inc. • Semiconductors & related devices • Delaware

This Asset Purchase Agreement (this “Agreement”) is entered into as of August 22, 2023 by and between MACOM Technology Solutions Holdings, Inc., a Delaware corporation (the “Buyer”), and Wolfspeed, Inc., a North Carolina corporation (the “Seller”). The Buyer and the Seller are sometimes referred to in this Agreement individually as a “Party” and collectively as the “Parties.” Capitalized terms used herein shall have the meanings ascribed to them in Article I or elsewhere in this Agreement.

SUPPLY AGREEMENT
Supply Agreement • August 22nd, 2007 • Cree Inc • Semiconductors & related devices • Hong Kong

This SUPPLY AGREEMENT (this “Agreement”), is dated and effective as of March 30, 2007 (the “Effective Date”), by and between COTCO LUMINANT DEVICE LIMITED, a company formed under the laws of Hong Kong and having its principal place of business at 6/F, Photonics Centre, No. 2, Science Park East Avenue, Hong Kong Science Park, Hong Kong (“Seller”) and LIGHT ENGINE LTD., a company formed under the laws of Hong Kong and having its principal place of business at 6/F, Photonics Centre, No. 2, Science Park East Avenue, Hong Kong Science Park, Hong Kong (“Buyer”).

COOPERATIVE AGREEMENT BETWEEN Cree, Inc. (The Recipient) AND CONCERNING Development of SiC Power Devices and Power Modules
Cooperative Agreement • August 20th, 2004 • Cree Inc • Semiconductors & related devices

This Agreement is entered into between the United States of America, hereinafter called the Government, represented by the U.S. Army Research Laboratory (ARL), and Cree, Inc., pursuant to and under U.S. Federal Law.

AMENDMENT NO. 1 TO UNSECURED CUSTOMER REFUNDABLE DEPOSIT AGREEMENT
Unsecured Customer Refundable Deposit Agreement • October 16th, 2024 • Wolfspeed, Inc. • Semiconductors & related devices • New York

This UNSECURED CUSTOMER REFUNDABLE DEPOSIT AGREEMENT (as amended by Amendment No. 1, this “Agreement”) is entered into as of July 5, 2023, between WOLFSPEED, INC., a North Carolina corporation (the “Borrower”) and RENESAS ELECTRONICS AMERICA INC., a California corporation (the “Lender”).

FORM OF PRE-FUNDED WARRANT TO PURCHASE COMMON STOCK
Warrant Agreement • March 19th, 2026 • Wolfspeed, Inc. • Semiconductors & related devices • New York

This Warrant is one of a series of similar warrants issued pursuant to that certain Securities Purchase Agreement, dated March 19, 2026, by and among the Company and the Investors identified therein (as amended, restated, supplemented or otherwise modified from time to time, the “Purchase Agreement”).