Photronics Inc Sample Contracts

EXHIBIT 4.2 REGISTRATION RIGHTS AGREEMENT
Registration Rights Agreement • June 6th, 2003 • Photronics Inc • Semiconductors & related devices • New York
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AGREEMENT AND PLAN OF MERGER
Agreement and Plan of Merger • September 24th, 1999 • Photronics Inc • Special industry machinery, nec • California
PHOTRONICS, INC $75,000,000 __% Convertible Subordinated Notes due 2004
Photronics Inc • April 28th, 1997 • Special industry machinery, nec • New York
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Credit Agreement • January 21st, 1999 • Photronics Inc • Special industry machinery, nec • New York
WITNESSETH:
Employment Agreement • January 26th, 2001 • Photronics Inc • Special industry machinery, nec • Connecticut
Photronics, Inc. AND The Bank of New York Mellon Trust Company, N.A. as Trustee INDENTURE Dated as of January 22, 2015 3.25% Convertible Senior Notes due 2019
Indenture • January 28th, 2015 • Photronics Inc • Semiconductors & related devices • New York

INDENTURE dated as of January 22, 2015 between Photronics, Inc., a Connecticut corporation, as issuer (the “Company”, as more fully set forth in Section 1.01) and The Bank of New York Mellon Trust Company, N.A., a national banking association organized under the laws of the United States, as trustee (the “Trustee”, as more fully set forth in Section 1.01).

9,638,554 Shares Photronics, Inc. Common Stock (Par Value $0.01 Per Share) UNDERWRITING AGREEMENT
Underwriting Agreement • September 14th, 2009 • Photronics Inc • Semiconductors & related devices • New York
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Limited Liability Company Operating Agreement • June 8th, 2006 • Photronics Inc • Semiconductors & related devices • Delaware
SECOND AMENDMENT AGREEMENT
Second Amendment Agreement • June 5th, 2000 • Photronics Inc • Special industry machinery, nec • New York
among PHOTRONICS, INC.
First Amendment Agreement • January 27th, 2000 • Photronics Inc • Special industry machinery, nec • New York
Exhibit 10.1 THIRD AMENDMENT AGREEMENT Dated as of June 12, 2001
Third Amendment Agreement • June 14th, 2001 • Photronics Inc • Semiconductors & related devices • New York
THIRD AMENDED AND RESTATED CREDIT AGREEMENT dated as of
Credit Agreement • January 3rd, 2014 • Photronics Inc • Semiconductors & related devices • New York

THIRD AMENDED AND RESTATED CREDIT AGREEMENT (this “Agreement”) dated as of December 5, 2013 among PHOTRONICS, INC., the FOREIGN SUBSIDIARY BORROWERS from time to time party hereto, the LENDERS from time to time party hereto, RBS CITIZENS, NATIONAL ASSOCIATION, as Syndication Agent, and JPMORGAN CHASE BANK, N.A., as Administrative Agent and Collateral Agent.

Exhibit 10.33 EMPLOYMENT AGREEMENT BETWEEN THE COMPANY AND MICHAEL J. YOMAZZO
Employment Agreement • January 26th, 2001 • Photronics Inc • Special industry machinery, nec
Contract
Section 382 Rights Agreement • September 24th, 2019 • Photronics Inc • Semiconductors & related devices • New York
CREDIT AGREEMENT
Credit Agreement • September 12th, 2002 • Photronics Inc • Semiconductors & related devices • New York
EMPLOYMENT AGREEMENT
Employment Agreement • December 23rd, 2019 • Photronics Inc • Semiconductors & related devices • Connecticut

THIS EMPLOYMENT AGREEMENT (this "Agreement") is entered into as of September 10, 2007 by and between Photronics, Inc., a Connecticut corporation (the "Company"), having a principal place of business at 15 Secor Road, Brookfield, CT 06804 and Christopher Progler ("Executive") residing at 5901 Woodwind Drive, Plano, Texas 75093.

RECITALS
Technology License Agreement • June 8th, 2006 • Photronics Inc • Semiconductors & related devices • Delaware
EMPLOYMENT AGREEMENT
Employment Agreement • January 6th, 2017 • Photronics Inc • Semiconductors & related devices • Connecticut

THIS EMPLOYMENT AGREEMENT (this “Agreement”) is entered into as of January 1, 2011 among Photronics, Inc., a Connecticut corporation (the “Company”), having a principal place of business at 15 Secor Road, Brookfield, CT 06804, PKL, a company incorporated under the laws of Korea (“PKL”) and Soo Hoo Jeong residing at 272-3, Gumi-Dong, Bundang, Seongnam, Kyeonggi, Korea 463-802 (“Executive”).

BY AND BETWEEN
Suit Lease • June 8th, 2006 • Photronics Inc • Semiconductors & related devices • Idaho
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RagingWire Telecommunications, INC. Master Services Agreement #1001.0.1
Master Services Agreement • January 6th, 2015 • Photronics Inc • Semiconductors & related devices • California

This Master Services Agreement("Agreement") is entered into effective as of January 11, 2002, ("Effective Date") by and between RagingWire Telecommunications, Inc., a Nevada corporation ("RagingWire") and Photronics, Inc., a Florida corporation ("Customer"). In consideration of the mutual covenants contained in this Agreement, RagingWire and Customer agree as follows:

SECOND AMENDED AND RESTATED SECURITY AGREEMENT
Security Agreement • January 6th, 2015 • Photronics Inc • Semiconductors & related devices • New York

THIS SECOND AMENDED AND RESTATED SECURITY AGREEMENT (as the same may be amended, restated, supplemented or otherwise modified from time to time, this “Security Agreement”) is entered into as of December 5, 2013 by and among PHOTRONICS, INC., a Connecticut corporation (the “Company”), the Subsidiaries of the Company listed on the signature pages hereto (together with the Company, the “Initial Grantors,” and together with any additional Subsidiaries, whether now existing or hereafter formed or acquired which become parties to this Security Agreement from time to time by executing a Supplement hereto in substantially the form of Annex I, the “Grantors”), and JPMORGAN CHASE BANK, N.A., a national banking association, in its capacity as contractual representative (the “Collateral Agent”) for itself and for the Holders of Secured Obligations (as defined in the Credit Agreement identified below). Capitalized terms used herein (including, without limitation, Article I hereof) and not otherwise

NON-QUALIFIED STOCK OPTION AGREEMENT *
Non-Qualified Stock Option Agreement • February 16th, 2005 • Photronics Inc • Semiconductors & related devices

PHOTRONICS, INC. (the “Company”), a Connecticut corporation, hereby grants [Name] (the “Optionee”) an option to purchase a total of [Number] shares of Common Stock (“Common Stock”) of the Company, at the price determined as provided herein, and in all respects subject to the terms, definitions and provisions of the 2000 Stock Option Plan (the “Plan”) adopted by the Company which is incorporated herein by reference.

RESTRICTED STOCK AWARD AGREEMENT
Restricted Stock Award Agreement • December 26th, 2023 • Photronics Inc • Semiconductors & related devices • Connecticut

THIS AWARD OF RESTRICTED STOCK (this "Award") made as of the ___ day of ______________ 20__ by Photronics, Inc., a Connecticut corporation (the "Company"), to #ParticipantName# (the "Recipient").

MERGER AGREEMENT
Merger Agreement • July 8th, 2015 • Photronics Inc • Semiconductors & related devices

WHEREAS, in order to integrate resources, reduce operating costs, and expand the economic scale of Party A, the Parties would like to execute this Agreement and pursue a merger with each other with consideration payable in Party A’s new shares.

CONTRIBUTION AGREEMENT
Contribution Agreement • December 19th, 2017 • Photronics Inc • Semiconductors & related devices
RESTRICTED STOCK AWARD AGREEMENT
Restricted Stock Award Agreement • January 6th, 2006 • Photronics Inc • Semiconductors & related devices

THIS AWARD OF RESTRICTED STOCK made as of the [Date] by Photronics, Inc., a Connecticut corporation (hereinafter referred to as the “Company”), to [Name] (hereinafter referred to as the “Recipient”).

LICENSE AGREEMENT
License Agreement • July 8th, 2015 • Photronics Inc • Semiconductors & related devices

This LICENSE AGREEMENT (“Agreement”) is entered into, as of this ____ day of__________, 2013by and between Photronics, Inc., a corporation organized under the laws of the State of Connecticut, U.S.A. with its principal place of business at 15 Secor Road, Brookfield, Connecticut, U.S.A. (“Photronics”) and Photronics Semiconductor Mask Corporation, a corporation organized under the laws of the Republic of China (hereinafter “ROC” or “Taiwan”) , with its registered office at 1F, No. 2, Lising Road, Hsinchu City, Hsinchu Science Park, Taiwan, R.O.C (“Company”). Each of Photronics and the Company is hereafter referred to as a “Party” and collectively the “Parties”.

JOINT VENTURE FRAMEWORK AGREEMENT
Joint Venture Framework Agreement • July 8th, 2015 • Photronics Inc • Semiconductors & related devices

This Joint Venture Framework Agreement (“Agreement”) is entered into on this 20th day of November, 2013 by and between Photronics, Inc., a corporation organized under the laws of the state of Connecticut, U.S.A. with its principal place of business at 15 Secor Road, Brookfield, Connecticut, U.S.A. (“Photronics”) and Dai Nippon Printing Co., Ltd., a corporation organized under the laws of Japan with its principal place of business at 1-1, Ichigaya Kagacho 1-chome, Shinjuku-ku, Tokyo, Japan (“DNP”). (Photronics and DNP are hereinafter individually a “Party” and collectively the “Parties”.)

RE: Consulting Agreement Dear Mike:
Photronics Inc • January 28th, 1998 • Special industry machinery, nec
RECITALS
Put/Call Option Agreement • September 14th, 2001 • Photronics Inc • Semiconductors & related devices • New York
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