Engineering Wafers. Each of the Parent Parties will have full access to all operational and engineering data and reports related to engineering wafers manufactured for JV Products manufactured at the Y6 Facility.
Engineering Wafers. WAFERS that are processed in accordance with the applicable special pricing in Exhibit B and the applicable special specifications in Exhibit C.
Engineering Wafers. The price of Engineering Wafers shall be as follows:
Engineering Wafers. Notwithstanding anything herein to the contrary, to the extent requested in any Purchase Order placed, or any change order to a Purchase Order issued, by a Purchaser, the Joint Venture Company shall manufacture and deliver Engineering Wafers in lieu of Conforming Wafers. The Manufacturing Capacity required to manufacture each Engineering Wafer shall be deemed to equal [***] of the Manufacturing Capacity required to manufacture a Conforming Wafer of the same Design ID. The Joint Venture Company shall promptly provide each Purchaser with full access to all data it reasonably requests relating to Engineering Wafers that are being manufactured by the Joint Venture Company for such Purchaser.
Engineering Wafers. The rights of the Parent Parties to receive Evaluation Wafers and Qualification Wafers (each as defined in the JV Master Agreements) under the JV Master Agreements apply to Evaluation Wafers and Qualification Wafers manufactured in the Y6 Facility. For the avoidance of doubt, WD may ship its share of Evaluation Wafers and Qualification Wafers to any location in its sole discretion subject to any terms and conditions of the Master Operative Documents that relate or apply to the shipment of Evaluation Wafers or Qualification Wafers by SanDisk, including applicable export control requirements; provided, that any such shipment by WD shall comply with applicable shipping procedures at the Yokkaichi Facility consistent with past practice.
Engineering Wafers. In the event Purchaser seeks to have Products manufactured using engineering wafers, and Adaptec agrees to manufacture such Products, Purchaser shall be responsible for payment of all additional costs incurred by Adaptec in connection with the manufacture of such Products, including: (a) mask building charges; (b) expedite fees (including those related to fabrication and assembly); and (c) cost differentials between engineering wafers and production wafers. (Purchaser acknowledges that the Prices set forth in Exhibit A are based upon production wafer cost.) Such costs shall be invoiced and paid as provided in Section 7.
Engineering Wafers. Upon Ramtron's request and in TI's sole but reasonable discretion, TI will provide to Ramtron such amount of engineering Wafers as Ramtron may require.
Engineering Wafers. For purposes of this Agreement, engineering wafers shall count towards any Quarterly Reservation, however pricing for such engineering wafers, including any expedite requests, shall be per GF’s then current published service price list, and the Parties shall engage in good faith negotiations regarding the delivery dates for such engineering wafers. The following requirements shall apply with respect to Customer’s orders and GF’s supply of engineering wafers: • As and when Customer has determined its engineering wafer plan needs, Customer may place purchase orders for engineering wafers and Customer shall provide quantity and split plan details. • If production wafer starts for the applicable calendar quarter are available (within the applicable Quarterly Commitment quantity):
Engineering Wafers. WAFERS that are processed in accordance with the applicable special pricing in Exhibit B and any applicable special specifications provided by PI.
Engineering Wafers. The rights of the Parent Parties to receive Evaluation Wafers and Qualification Wafers (each as defined in the JV Master Agreements) under the JV Master Agreements apply to Evaluation Wafers and Qualification Wafers manufactured in the K1 Facility, and TMC’s rights to receive Evaluation Wafers and Qualification Wafers under the JV Agreements are hereby extended to TMI. For the avoidance of doubt, WD may ship its share of Evaluation Wafers and Qualification Wafers to any location in its sole discretion subject to any terms and conditions of the Master Operative Documents that relate or apply to the shipment of Evaluation Wafers or Qualification Wafers by SanDisk, including applicable export control requirements; provided, that any such shipment by WD shall comply with applicable shipping procedures at the Yokkaichi Facility consistent with past practice with reasonable adjustments based on attributes specific to the K1 Facility or as otherwise required due to the K1 Facility’s being situated at the Kitakami Facility, and not at the Yokkaichi Facility.
